October 9, 2024 - October 10, 2024
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package.
Pricing
- Members: $645
- Non-Members: $745
- Students/Vets: $545
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Time
2:00 pm - 6:00 pm PDT
Location
United States
Course Description
The principles of Microelectronics packaging range from Electronics, Mechanical, and Material to Chemical Engineering. Due to this multi-discipline nature, many industry professionals don’t know what they don’t know as they do not undergo multi-discipline training to understand these principles. This course provides the necessary technical knowledge for industry professionals.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
- Directors
- Managers
- Process Engineers
- R&D Engineers
- Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
- Understand the principles in the evolution of IC packaging and how the semiconductor industry has evolved with time.
- Understand the principles of Interconnections ranging from TAB, and Wirebond to various Flip Chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development.
- Review the interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging.
- Explain the assembly flow and new assembly techniques from backgrinding to singulation.
- Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.
Course Topics
- Advanced packaging and material characterization.
- Packaging principles and how packaging evolves into heterogeneous packaging.
- Packaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.
- Wirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.
- Assembly processes from backgrinding to singulation for QFP and FBGA packages.
- Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.
Instructor
Dr. Lee Teck Kheng
Institue of Technical Education
Please note that only the person who registered will receive a certificate of completion.