downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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Concept & Vision of Future Wafer Fab Equipment

 

ABSTRACT

The semiconductor market is expected to double towards 2030. To achieve this, countries and governments are supporting the development and manufacturing environment. Moore's Law continues to drive the semiconductor industry, and its technical requirements are diversifying and diversifying. In my keynote speech, I will introduce the future vision of the equipment that TEL is aiming for. 


BIOGRAPHY 

Takashi Hayakawa

After working as process engineer at a semiconductor device manufacturer, he changed jobs to Tokyo Electron (TEL) in '98. Engaged in semiconductor manufacturing equipment development and process development at TEL. After that, as a development and marketing member, he led product planning such as etching equipment and deposition equipment, as well as the development of modules that spanned multiple of the company's products. Currently, he is in charge of C&F (Concept & Feasibility) and core technology development, promoting innovation through next-generation equipment development and collaboration with various research institutes and partner companies.