Sustainability Efforts in Semiconductor Manufacturing: Providing Solutions in Low GWP Etch Gases
The semiconductor industry has traditionally relied on simple hydrofluorocarbon (HFC) molecules for required etch process steps. These molecules enable the progression to advanced nodes, but also create troubling concerns over Global Warming Potential (GWP). Air Liquide’s novel enScribe™ portfolio of etchant gases brings environmental benefits, as its products are designed to reduce the GWP impact associated with traditional etchants. These new materials address the technical challenges, notably the high aspect ratio etches required for today’s 3D NAND process flow, while also reducing the overall GWP footprint of the fab. However, they do not represent an industry-wide replacement of gases, as legacy applications are projected to continue to use conventional gases in the future.
BIOGRAPHY
Stefan Wiese received his PhD in Inorganic/Organometallic Chemistry from Georgetown University in 2011. He went on to pursue a 2-year postdoc at Pacific Northwest National Lab in alternative renewable energy development before starting at Air Liquide in 2013 as a research scientist. After 11 years with Air Liquide and different positions focusing on advancing their Semiconductor materials, Stefan is now a Director of Product Management.