EUV Scanner Systems for High Volume Manufacturing
ASML NXE:3600D scanners are now commonly used for High Volume Manufacturing (HVM) of 3 nm logic devices as well as 10 nm class memory devices. In 2024 the ASML NXE:3800E scanner has been released and is now shipping to customers to support the next HVM nodes.
In this paper we will share the latest performance of these systems, including improvements in overlay, critical dimension (CD) control, stability, reliability, and high productivity
Furthermore, we will describe the latest technology supporting the ASML roadmap for further improving cost of technology via increased productivity and platform commonality. This will include updates on the next NXE (0.33 NA) and EXE (0.55 NA) systems.
Lastly, the ASML’s EUV sustainability roadmap will be presented, showing progress and steps towards a significant reduction in energy consumption per wafer exposure.
BIOGRAPHY
40 years of experience in IC industry in research, process development, product development, product planning, manufacturing, marketing, program and customer management.
Hobbies include art, photography, music, skiing, motorcycling, scuba diving, travel, and good food. Married, one daughter, many friends
Experience
2023 – present Adjunct Professor at Purdue ECE
2022 – present Senior strategy consultant at ASML
2005 – 2022 ASML Senior Director, Computational Litho
2003 – 2004 Takumi Technology, EDA software
1999 – 2003 Philips Semiconductors, Digital TV design
1999 – 2003 Phage International, medical startup
1993 – 1999 National Semiconductor, circuit simulation
1996 – 1997 Semiconductor Research Corp, TCAD director
1989 – 1993 Stanford University (Research Fellow)
1984 – 1989 Philips Research, transistor physics
1980 – 1984 PhD, Solid State Physics, Utrecht University
1974 – 1980 Master's, Physics & Astronomy, Utrecht University
Fun Fact
Started my career working on 3 mm technology, finished working on 2 nm technology