Materials Advancements Enabling AI Technology
A search engine describes AI as the ability of machines to perform tasks that typically require human intelligence. To semiconductor technologists, AI is composed of multiple, high performing logic/graphics processors working in parallel with hyper fast interconnections to stacked high bandwidth memory. AI pushes processor performance and technology innovation to their limits. Device manufacturers accomplish this by reducing dimensions of the features, inserting novel architectural improvements, introducing new materials and processes, and utilizing advanced packaging. In this presentation, the evolution of processors and memory will be highlighted, with emphasis on the novel materials necessitated as technologies scale.
BIOGRAPHY
As an Enterprise Fellow in the Advanced Technology Engagement Team at Entegris, Dr. Besser is responsible for developing the corporate logic technology roadmap and partner engagement strategy. Paul’s career began at Advanced Micro Devices where he researched novel materials for semiconductor process technology, becoming an AMD Fellow and leading technology development teams to take materials innovations from research to development to manufacturing. After AMD, Paul has succeeded in senior technology leadership roles at Unity Semiconductor, GlobalFoundries, Lam Research and ARM. Paul studied Materials Science and Engineering, graduating from North Carolina State University (B.S.) and Stanford University (M.S. and Ph.D.). He has co-authored >100 research publications, holds >260 U.S. patents.