downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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Exploring Sustainable Alternatives in Semiconductor Manufacturing

ABSTRACT COMING SOON


BIOGRAPHY

Brian Coppa, ULVAC

Brian is a Product Engineering Lead at ULVAC focused on deposition and plasma etch/clean wafer process equipment solutions for leading-edge semiconductor fabs. He has two decades of microelectronics industry experience in process engineering and business development from positions at: Micron/Intel, ASM, Tokyo Electron and EMD Electronics/Merck KGaA, Darmstadt, Germany and as a consultant to numerous other companies across the overall supply chain. He has authored over 17 US and foreign patent publications and numerous technical journal articles, which have received many prestigious citations globally. Brian has been part of the leadership team for the SEMI Smart Manufacturing Initiative since its inception in 2018 and is leading a subcommittee entitled, "Accelerating Sustainability with Smart Manufacturing," which is leveraging Industry 4.0 best practices to publish an industry roadmap as a guide for device-making facilities. His doctorate and master's degrees are in materials science engineering from North Carolina State University and he has a B.S. in physics from the University of Arizona.