Dr Sitaram Arkalgud is Vice President of Technology (Integration, Operations and Major Programs) at TEL Technologies Center America (TTCA), with 3DI and Heterogenous Integration as one of his responsibilities. The focus of TTCA’s 3DI program is understanding the fundamental mechanisms governing fusion and hybrid bonding and demonstrating the scalability and reliability of the technology.
Prior to joining TTCA in 2019, Sitaram led the application of fusion and hybrid bonding at Invensas (Xperi), and also managed the 3DI group. He played a key role in Invensas’ acquisition of Ziptronix, a pioneer in hybrid bonding. Sitaram worked previously at SEMATECH, where he built up a 3DI program focused on the development and manufacturability of TSV and Cu/Cu thermocompression bonding. This was preceded by work at Infineon/Qimonda (FeRAM, MRAM development and memory strategy) and Motorola (eDRAM, DRAM, SRAM and Logic development) where he worked in strategy, process, integration and product areas.
Sitaram obtained his MS and PhD in Materials Engineering from the Rensselaer Polytechnic Institute, and his Bachelors in Engineering from NIT-K (India). He holds 63 US patents, most of which are in Advanced Packaging. He has presented at several international conferences, most recently on fusion and hybrid bonding technology. He is also a Senior Member of the IEEE EPS.