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May 12, 2021 - May 18, 2021

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[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.

 

Materials: Driving a New Leap Forward 

Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.  

SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.  

Add to Calendar 2021-05-12 00:00:00 2021-05-18 00:00:00 SMC Korea 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.   Materials: Driving a New Leap Forward  Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.   SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.   Online South Korea SEMI.org contact@semi.org Asia/Seoul public
Location

Online
South Korea

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SPONSORS

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NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live streamed on Afternoon, Wednesday, May 12(KST).
  • On-demand Session will be provided 24/7 during the event period(May 12-18)

 


 

CONTACT

  •  Sera Jung(+82-2-531-7831 / sjung@semi.org)

Agenda

[LIVE] Collaboration – May 12(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
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Hyun-Goo Kang
Team Leader of C&C Material Development Team of R&D Center,
SK hynix

Advanced Material Development in Perspectives of CMP & Cleaning Process for Semiconductor (Korean)

2:35 pm - 3:05 pm
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Yun-Ho Kim
Material Technology Group Leader (Foundry Division),
Samsung Electronics

Special Singularity beyond Material; Winter but Opportunity is Coming (Korean)

[On-demand] Keynote (Translation provided)

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Christoph Adelmann
Scientific Director,
imec

Materials for Sub-5-nm Semiconductor Devices (English)

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Bruce Tufts
Vice President, Fab Materials Organization, Global Supply Chain,
Intel

Trends and Observations in Materials Quality at Advanced Process Nodes (English)

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Jijen Vazhaeparambil
Senior Vice President and General Manager, Surfscan and ADE,
KLA

Cost-Effective Fab Material Qualification with Un-patterned Wafer Inspection (English)

[On-demand] Session 1: Emerging Materials and Patterning

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Myoung-Kuy Lee
Manager of Strategic Business Development Field Marketing,
ASML

0.33 NA EUV Systems for High Volume Manufacturing (Korean)

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Takanori Kawakami
General Manager at Lithography Materials Lab. of Fine Electronic Materials Research Laboratories
JSR Corporation

Stochastic Effects on EUV CAR Systems: Investigation of Materials Impact (English)

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Kazuma Yamamoto
Associate Manager, Global R&D,
Merck

Mitigation of Pattern Collapse in EUVL (English)

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Ashutosh Bhabhe
Global Wet Etch and Cleans Applications Manager,
Entegris

Removal of Trace Metals from High Temperature Isopropyl Alcohol (IPA) (English)

[On-demand] Session 2: Materials Integration and Challenges

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Young Hun Kim
Epi. Technical Engineering Team Leader,
SK Siltron

Current Demands on Wafers for CIS (Korean)

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Youngwoo Park
EVP/Senior Technology GM,
Tokyo Electron

Gate-All-Around Transistors: Fundamentals & Structures (Korean)

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Andreas Fischer
Technical Director
Lam Research

Thermal Atomic Layer Etching – An Emerging and Enabling Etching Technology (English)

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Mihaela Balseanu
Sr. Technology Director
Applied Materials

Selective ALD in a Continuous World, New Techniques and Advancements (English)

[On-demand] Session 3: New Waves in Materials

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JinSuk Jeong
Director / Project Leader,
Amkor Technology

Advanced Packaging : Trends, Technologies and Challenges (Korean)

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Luis Andia
RF Business Development Senior Manager,
Soitec

Engineered Substrates for New Waveforms and New Applications (English)

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Marco Arnold
Global R&D Manager,
BASF

Next Generation Metallization Solutions for Advanced Packaging (English)

[On-demand] Session 4: Market Trends

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Bob Johnson
VP Analyst
Gartner

Semiconductor Market Outlook: Strong Growth Ahead (English)

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Brandon Prior
Senior Consultant
Prismark

Advanced Packaging Growth: Focus on New Package Approaches (English)

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Mark Thrisk
Managing Partner,
Linx Consulting

Materials Demand in the Next Supercycle (English)

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, May 7(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 280,000
    • Non-members: 330,000
Registration