May 12, 2021 - May 18, 2021
[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.
Materials: Driving a New Leap Forward
Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.
SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.
- The agenda will be subject to change without notice.
- Presentation files agreed by speakers will be provided to attendees.
- Live session will be live streamed on Afternoon, Wednesday, May 12(KST).
- On-demand Session will be provided 24/7 during the event period(May 12-18)
- Sera Jung(+82-2-531-7831 / email@example.com)
[LIVE] Collaboration – May 12(Wed)
Advanced Material Development in Perspectives of CMP & Cleaning Process for Semiconductor (Korean)
Special Singularity beyond Material; Winter but Opportunity is Coming (Korean)
[On-demand] Keynote (Translation provided)
Materials for Sub-5-nm Semiconductor Devices (English)
Trends and Observations in Materials Quality at Advanced Process Nodes (English)
Cost-Effective Fab Material Qualification with Un-patterned Wafer Inspection (English)
[On-demand] Session 1: Emerging Materials and Patterning
0.33 NA EUV Systems for High Volume Manufacturing (Korean)
Stochastic Effects on EUV CAR Systems: Investigation of Materials Impact (English)
Mitigation of Pattern Collapse in EUVL (English)
Removal of Trace Metals from High Temperature Isopropyl Alcohol (IPA) (English)
[On-demand] Session 2: Materials Integration and Challenges
Current Demands on Wafers for CIS (Korean)
Gate-All-Around Transistors: Fundamentals & Structures (Korean)
Thermal Atomic Layer Etching – An Emerging and Enabling Etching Technology (English)
Selective ALD in a Continuous World, New Techniques and Advancements (English)
[On-demand] Session 3: New Waves in Materials
Advanced Packaging : Trends, Technologies and Challenges (Korean)
Engineered Substrates for New Waveforms and New Applications (English)
Next Generation Metallization Solutions for Advanced Packaging (English)
[On-demand] Session 4: Market Trends
Semiconductor Market Outlook: Strong Growth Ahead (English)
Advanced Packaging Growth: Focus on New Package Approaches (English)
Materials Demand in the Next Supercycle (English)
- Registration Close: 6 pm, Friday, May 7(KST)
- Registration Fee
- SEMI Members / Students: KRW 280,000
- Non-members: 330,000