Wafer Cleaning Technology in 3D Integrated Circuit Devices
Presentation by Ian Brown, Vice President of Engineering at SCREEN Semiconductor Devices, Inc.
Presented at SEMICON West, July 12, 2022
Video
In this presentation, Ian Brown reviews the evolution of particle removal methods commonly used for logic and memory devices and looks forward to the future of what technologies should be considered by device manufactures to support high yield in increasingly three-dimensional devices.