downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

June 18, 2020

MSIG Okmetic MEMS Substrate June 18

A SEMI MEMS & Sensors Industry Group (MSIG) Hosted Webinar

MSIG Logo
Time

8:00 am - 9:00 am

Add to Calendar 2020-06-18 08:00:00 2020-06-18 09:00:00 MSIG Webinar - MEMS Substrate Evolution: Standards to drive efficiency & cost reduction A SEMI MEMS & Sensors Industry Group (MSIG) Hosted Webinar Online, Pacific Time, United States SEMI.org contact@semi.org America/Los_Angeles public
Location

Online, Pacific Time,
United States

MSIG Okmetic MEMS Substrate June 18

The worldwide expansion of MEMS and photonic devices in Consumer, Automotive, and IoT applications is driving new requirements to the supply chain. Advanced substrates are needed to meet these requirements. Applying standardization to advanced substrates will aid efficient use of material, reduce cycle time and provide product cost reduction. SEMI’s MEMS & Sensors Industry Group (MSIG) aims to enable such standards.

Recently, MSIG’s multi-company, industry-collaborative Manufacturing Working Group published the SEMI MS12 standard- Specification for Silicon Substrates Used in Fabrication of MEMS Devices.  The SEMI MS12 document provides information on 150 mm and 200 mm diameter customized silicon substrates to be used for MEMS device fabrication, including physical dimensions, surface conditions, and basic electrical properties. Utilizing this guidance will allow the stocking of standard material, lowering the time to purchase, simplifying front-end operations, reducing time to market and lowering unit costs significantly.

This webinar will showcase three case studies demonstrating how the cost of ownership can be enhanced through various MEMS substrate platforms. Substrate manufacturers can apply the MEMS standardization and bring added value to their customers.

1. Cost savings with better integration and elimination of front-end process steps at customer site

2. Cost-savings through better flatness capabilities enabling significant die shrink and new capabilities for the customer.

3. Advantages of patterned SOI – i.e.) Silicon interposer on C-SOI® platform

Agenda

8:00 am
Michelle Bourke Lam Research
Michelle Bourke
Senior Director of Strategic Marketing, Lam Research

Introduction

Moderator

View Biography

8:10 am
Petri Santala Okmetic
Petri Santala
Manager, Customer Support, Okmetic Inc.

Speaker Biography

Mr. Santala received his B.Sc. in Process Engineering at the Espoo University of Applied Sciences Finland. Mr. Santala has over 20 years of experience in Silicon based material engineering. He has worked for Okmetic since 1999 and held various positions related to R&D, process engineering, quality and applications support. Currently he is working as Customer Support Manager being responsible for Okmetic’s Technical Customer Support for the North America.

8:50 am

Q&A

Registration

Webinar - The Future of Work: Leading Remote Teams

Open to all.

Webinar - The Future of Work: Leading Remote Teams