MEMS Packaging Enabling Sensors for a Smarter World.
ABSTRACT
MEMS are the human interface to our increasingly connected world and are integral to growing areas of IoT, Automotive, and Biometric Authentication. Due to the wide range of sensor types and device environments, packages must begin with some standard platforms and then be customized as needed to the specific device requirements. In this presentation, I’ll describe MEMS package platforms and technology building blocks that are enabling a wide range of MEMS sensors, and even helping to bring multiple sensors onto a single package.
BIOGRAPHY
Roger joined Amkor in 2017 and is currently a manager in the MEMS and Sensor Products group, responsible for business development across a mix of MEMS and sensor packages. Prior to assuming his current role, he worked in worldwide R&D, building metrologies for thermal, mechanical, and electrical testing of flip chip and wafer-level packages. Prior to joining Amkor, Roger held engineering positions at Intel, developing package and system-level thermal solutions for high heat flux servers and HPC processors. He holds multiple US patents related to novel MEMS devices and packaging technologies and holds a master’s degree in Mechanical Engineering from Stanford University.