downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

May 11, 2017

Add to Calendar 2017-05-11 00:00:00 2017-05-11 00:00:00 June 1st 2017: The Annual Tokyo SOI Workshop - Japan United States SEMI.org [email protected] America/Los_Angeles public
Location

United States

3rd ANNUAL SOI TOKYO WORKSHOP, 1.5 DAYS EVENT
Thursday, June 1st, 2017 (DAY 2)
ONLINE REGISTRATION IS CLOSED, PLEASE REGISTER ON SITE AT TAKEDA HALL.
Program
“Convergence of IoT, Automotive through Connectivity”

(@ Takeda Hall, Tokyo University, Tokyo) 8:30 – 9:20am             Registration 9:20 – 9:30am             Welcome - Carlos Mazure, Executive Director, SOI Industry Consortium Ultra Low Power Applications 9:30 – 10:00am          Kenichi Nakano, General Manager, Sony IoT 10:00 – 10:30am       Value Added FD-SOI Technology to be Major Player in IoT, Automotive, and Connectivity - Yongjoo Jeon, Principal Designer in Foundry Marketing, Samsung 10:30 – 11:00am       Networking Break Technologies for Automotive 11:00 – 11:30am       LIDARs and Sensor Fusion ECUs  Advancing ADAS Architectures towards Automated Driving - Akhilesh Kona, Senior Analyst, IHS Markit 11:30 – 12:00pm      MIPS Leading Heterogeneous Compute in Automotive & IoT - Steven Yeung, Design Manager, MIPS, Imagination Technologies 12:00 – 12:30pm     Future of Automotive Industry - Road is Paved with SOI - Vincent Roger, Corporate Business Developer, CEA-Leti 12:30 – 1:30pm          Lunch IoT – Connectivity - Infrastructure 1:30 – 2:00pm             Enabling An Interconnected Digital World - Jonathan Smith, Director, Cadence 2:00 – 2:30pm           Nokia Future X Network for 5G and IoT -Brian Cho, Head of Technology for APAC & Japan, Nokia on infrastructure for 4G/5G 2:30 – 3:00pm             Delivering on the Promises of 5G: Semiconductor Solutions for the Next Wave of Data - Peter Rabbeni, Senior Director, GlobalFoundries 3:00 – 3:30pm            Sensor-to-Cloud Connectivity Solution for IoT -  Hiroshi Noguchi, Director of AMG Product Marketing, STMicroelectronics 3:30 – 4:00pm             Coffee Break Supply Chain 4:00 – 4:30pm             Enabling SOI and IoT:  An Equipment and Materials Engineering Perspective - Sesh Ramaswami, Managing Director, Applied Materials 4:30 – 5:00pm             SCREEN Equipment Manufacturer: Full participation within the SOI Consortium - Hirofumi Uchida, Senior VP, Screen 5:00 – 5:30pm             Role of Substrate in Accelerating Mass Adoption of SOI Technologies -Thomas Piliszczuk, EVP, Soitec Closing Remarks 5:30 – 5:40pm             Giorgio Cesana, Executive Co-Director, SOI Industry Consortium

ACCESS EVENT LOCATION June 1st
  • June 1st, 2017 @ Takeda Hall, Tokyo University, Tokyo,
    University of Tokyo, Takeda Hall, 7 Chome-7-3-1 Hongo, Bunkyo-ku, Tokyo-to 113-8654, Japan

  Photo: Tokyo Aerial View 15 ©Tokyo Convention & Visitors Bureau