How Deposition and Etch Are Reshaping the 3D Era
ABSTRACT
AI is fueling unprecedented growth and accelerating demand for advanced devices. Its requirements for performance, power, and area scaling are driving memory and logic devices toward 3D architectures.
At the heart of this 3D transformation, processing steps must enable taller, perpendicular structures as well as smaller features. Meeting these requirements calls for new deposition and etch capabilities that did not exist before, leading to breakthroughs needed in areas such as atomic-level deposition and etch (ALD and ALE), high-aspect-ratio processing, dry resist EUV patterning, and the adoption of new materials like molybdenum (Mo). As a result, the transition to 3D devices will drive increased intensity of deposition and etch processing.
This presentation will explore how deposition and etch are critical to unlocking the future of 3D devices, with increasing velocity required to meet the demands of AI-driven innovation.
BIOGRAPHY
Vahid Vahedi is senior vice president, chief technology and sustainability officer at Lam Research. In this role, he is responsible for driving innovation breakthroughs that define the next generation of semiconductors and result in the expansion of the company’s portfolio of best-in-class products and solutions. He also leads the Company’s sustainability programs and execution of responsible business practices to support net zero goals.
Vahid has nearly 30 years of experience in technology and business leadership. Joining Lam in 1995, he was previously the senior vice president and general manager of the company’s Etch Business Unit, where he was responsible for the launch of Sense.i®, Lam’s most innovative etch platform to date. Prior to that, he held a range of leadership positions at the company, supporting product management and marketing for the Etch Business Unit, as well as overseeing development of Lam’s dielectric etch, conductor and 3DIC etch innovations.
Vahid earned his Ph.D., M.S., and B.S. degrees in electrical engineering and computer science from the University of California at Berkeley.