Enabling the Next Era of High-Density Computing
ABSTRACT
The growing demand for increased computing capacity and speed is driving investment in new technologies that bring diverse functions closer together. As computing density rises and more capabilities are integrated into a single module, requirements such as higher interconnect density, greater power dissipation, and expanded local memory access are accelerating both technology development and capacity expansion. In addition, geopolitical factors are reshaping supply chain investment strategies.
BIOGRAPHY
David McCann is Sr VP in the Business Unit at Amkor Technology where he is responsible for Amkor’s test business, turnkey strategy, and for Amkor’s new US assembly/test facility. Previously, he was VP of Post Fab Operations and Development at Global Foundries for 8 years, responsible for internal bump and probe factories, and Packaging and Test Development and Operations at external suppliers.
Before joining Global Foundries, David led the Flip Chip Business Unit at Amkor Technology where he worked for 11 years.
He has also worked in the photonics and medical electronics industries.
David presently serves on the IEEE Electronics Packaging Society (EPS) Board of Governors as VP of Technology.