ABSTRACT
Making Moore More Possible: The Resurgence of 200 mm Manufacturing
A considerable amount of time and effort has been invested in chasing Moore’s Law. It’s been a huge success that has left its mark on our industry. But as we continue to innovate to smaller geometries, we must also acknowledge that Moore’s Law via transistor scaling will come to an end. Now is the time to disrupt conventional thinking so we can begin preparing for life beyond traditional manufacturing approaches. For the foundry segment to continue delivering manufacturing innovation, we must embrace new materials, new architectures, heterogeneous integration, and new ways of enabling capability beyond traditional scaling. In many respects, we’re entering a golden age for 200 mm manufacturing. The 200 mm fab operates in a sweet spot of automation that can support unconventional thinking without the constraints of a totally automated 300 mm fab. These facilities hold the key to enabling the next wave of innovation.
BIOGRAPHY
Mr. Sonderman serves as President & CEO for SkyWater and is a member of the company’s board of directors, with comprehensive responsibility for all business functions and operations. He has served in this position since 2017. Prior to joining SkyWater, he was VP & GM for Rudolph Technologies’ Integrated Solutions Group where he was responsible for delivering industry-leading growth and profitability for the company’s software division. Previously, he served as VP of Manufacturing Technology at GlobalFoundries, a $4B full-service semiconductor foundry, formed as a spin-off of AMD’s manufacturing operations in 2009. During his tenure, he built and led a team that transformed AMD’s manufacturing operation into an independent manufacturing powerhouse able to effectively compete with companies ten times its size. Prior to the spin-off, Mr. Sonderman served for over a decade in various executive management and engineering positions with AMD.
He has authored numerous articles in the area of manufacturing technology, holds 50 patents and is a sought-after expert on semiconductor issues. Mr. Sonderman received a BS in Chemical Engineering from the Missouri University of Science Technology and an MS in Electrical Engineering from National Technological University.