Enabling Power Efficiency, Scaling and Economics with Chiplets
ABSTRACT
As the industry enters the new era of advanced packaging, the adoption of chiplets is becoming increasingly important. Economics is a key driver in the adoption of chiplets, but there are many advantages. Chiplets offer power efficiency and scaling advantages previously unachievable with SOC. A chiplet is not a package, but it is a new approach to system, package, and chip design. There are power performance area and cost savings associated with each different package option. This presentation examines the advantages of the many options, including the emerging 3D hybrid bonding format. Challenges such as design, test, assembly, and thermal are discussed.
BIOGRAPHY
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She was the editor of Recent Developments in Tape Automated Bonding published by IEEE Press. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, the Sidney J. Stein International Award in 2019, and she is an IMAPS Fellow. She is a member of MEPTEC, SMTA, and SEMI. She serves on the JEDEC Task Force JESD-94 Working Group Application Specific Qualification Using Knowledge Based Test Methodology. She has served on the IEEE CPMT Board of Governors for two terms. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. She received her M.A. from University of Texas, in 1981.