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US Fabs of the Future

ABSTRACT

We have entered the age of the “Data Driven Economy” and Memory capacity growth has been a major Enabler of this transition.  Micron Technology’s ability to design and produce innovative memory and storage solutions that meet the needs of big data, high performance computing and AI will determine how quickly our world realize the benefits from these advances in computing across multiple industries.  With the recent CHIPS and ITC legislation semiconductor manufacturers can now cost competitively build fabs in the US.  Micron has announced plans to build fabs at our headquarters in Boise, ID and a mega-fab in Syracuse, NY to produce our industry leading DRAM technology.  Micron is committed to building these industry leading fabs to meet industry demand with a focus toward environmental sustainability and progress.  Strong collaboration between Micron and OEM partners will be required to build these fabs of the future.


BIOGRAPHY

Scott Gatzemeier, Micron Technology

Scott Gatzemeier is Corporate Vice President of Front End US Expansion at Micron Technology. Scott has more than 25 years of experience across probe, fab engineering, operations, and technology development. Scott has been working on US expansion initiatives for the past year and is responsible for Micron’s Boise and New York manufacturing expansion projects.

Scott started his career at Micron in 1997 as an intern of the DRAM Probe Engineering team. After being converted to full time, he held positions of increasing responsibilities in the probe engineering team. In 2006, he joined IM Flash to help with the startup leading several teams over time including Probe Engineering, Product Integration Engineering, Quality Engineering, and eventually becoming the Fab Director. Scott moved back to Micron as Sr. Director, Manufacturing Development Engineering and subsequently became the Vice President of  Research & Development Operations where the team delivered strong results and improvement in cycle time, quality, and cost reductions. In his previous role as Vice President of Yield Technology and Data Science, the team developed the data infrastructure and solutions for Technology Development and Front End manufacturing as well as developing and executing the roadmap for defection inspection and yield enhancement.

Scott holds a master’s in information and data science from UC Berkeley School of Information and a bachelor of science in electrical engineering from University of North Dakota where he graduated with distinction. A holder of 17 U.S. patents in fields of DRAM and NAND technologies, he also earned an MBA business degree from National Technology University. In his spare time, Scott enjoys spending time with his family and enjoying the outdoors hiking, snowboarding, running, and biking.