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October 16, 2019

Beyond Moore's Law: Heterogeneous Integration Roadmap and Implications for the Materials Industry webinar

A SEMI Electronic Materials Group (EMG) Hosted Webinar

Time

10:00 am - 11:00 am

Add to Calendar 2019-10-16 10:00:00 2019-10-16 11:00:00 EMG WEBINAR - Heterogeneous Integration Roadmap & Implications for the Materials Indsutry A SEMI Electronic Materials Group (EMG) Hosted Webinar Online, Pacific Time, United States SEMI.org contact@semi.org America/Los_Angeles public
Location

Online, Pacific Time,
United States

Beyond Moore's Law: Heterogeneous Integration Roadmap and Implications for the Materials Industry webinar

Since 2016, the International Technology Roadmap for Devices and Systems (IRDS)  has been working together with SEMI on a unifying pre-competitive roadmap to focus and drive innovation. The Heterogeneous Integration Roadmap (HIR) represents an opportunity to combine the efforts of SEMI, other industry groups, and leading-edge manufacturers to re-establish this driving force and outline goals to be met in the era of heterogeneous integration and the challenges that must be overcome in the process.

As a follow on to the Strategic Materials Conference, in this webinar we will explore the HIR itself and issues that arise as new materials and architectures meet to solve integration challenges. The webinar will cover the HIR from the perspective from a semiconductor materials supplier, followed by Jeff Gambino, Senior Process Integration Engineer at ON Semiconductor, who will outline their efforts in this space and the materials issues being addressed from the fab perspective.

 

If you have any questions about the webinar or having issues registering please email Ayo Kajopaiye - emg@semi.org

Agenda

10:00 am - 10:05 am

Introduction

10:25 am - 10:50 am
Bill Bottoms_pic
Bill Bottoms, Ph.D
President and CEO, Third Millennium Test Solutions - Co-Chair, Heterogeneous Integration Roadmap Committee

Speaker Biography

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.

Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries.

Emeritus Member of the Board of Tulane University
Co-Chair of the Heterogeneous Integration Roadmap
Chairman of the SEMI’s Awards Committee
Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
Member of the Board of MIT’s Microphotonic Center
Chairman of Fluence Analytics
Chairman of Third Millennium Test Solutions

10:05 am - 10:25 am
Jeff Gambino, PhD
Jeff Gambino, Ph.D.
Senior Process Integration Engineer, ON Semiconductor

Speaker Biography

Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.

He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he worked on copper interconnects, CMOS image sensors, RF devices, and 3D integration.

He joined ON Semiconductor, Gresham, OR, in 2015. He is currently working on CMOS image sensors and high voltage semiconductors. He has published over 200 technical papers and holds over 500 patents.

10:50 am - 10:55 am

Q&A

10:55 am - 11:00 am

Wrap-up

Registration

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Complimentary for SEMI Members.

$99 for Non-Members.

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