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November 7, 2019 - November 8, 2019

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The conference provides a platform for business leaders and technology experts in the ATE semiconductor as well as EDA supply chain ecosystem to share their insights and perspectives in these areas of interests for an active, engaging and thought-provoking discussion session.

Add to Calendar 2019-11-07 00:00:00 2019-11-08 00:00:00 Advanced Semiconductor Technology Conference (ASTC) The conference provides a platform for business leaders and technology experts in the ATE semiconductor as well as EDA supply chain ecosystem to share their insights and perspectives in these areas of interests for an active, engaging and thought-provoking discussion session. Marina Bay Sands Convention Centre 10 Bayfront Avenue Jasmine Ballroom | Level 3 SINGAPORE 018971 Singapore SEMI.org contact@semi.org Asia/Singapore public
Location

Marina Bay Sands Convention Centre
10 Bayfront Avenue
Jasmine Ballroom | Level 3
SINGAPORE 018971
Singapore

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Advanced Packaging and System Level Test for the era of High-Performance Computing (HPC) and Artificial Intelligence (AI)

The next revolutionary innovation in advanced packaging and system test to meet the quest of size, cost, performance and manufacturability is discussed at this forefront forum for the megatrend of HPC&AI as well as 5G.

What is the market size of such drivers in fueling these disruptive packaging and testing technologies? What are the key features in advanced packaging and system testing technology is in play enabling competitive business capture? What are the implications of the demand of such new disruptive technologies in the ATE space offers to Southeast Asia Foundries, IDM ad OSATs players?

The conference also features latest innovative solutions through exhibit booths display. 

Who should Attend

•    High level professionals specializing in the advanced and emerging application
•    Research & development specialists in advanced packaging and test
•    Business development and Marketing specialists
•    Academics and higher research institutes

Organized by SEMI, ESDA, MSIG

SEMI_ESDA_MSIG

Supporting partners:

A*STAR IME | e2i | HRDF | IMEC | Singapore Semiconductor Industry Association | Workforce Singapore

IME
e2i
HRDF

 

 

 

 

 

IMEC
SSIA
WSG

Agenda

Thursday, 7 Nov 2019 - Day 1

10:00 am - 10:30 am

Registration

10:45 am - 12:00 pm

ASTC 2019 Opening Ceremony in conjunction with FLEX SEA 2019

10:45 - 10:55:
Welcome Speech by SEMI SEA President, Ms NG Bee Bee

10:55 - 11:00:
MOU Signing Ceremony between SSIA and SEMI SEA

11:00 - 11:30:
Special Guest Speaker: UOB Chief Economist, Mr Alvin LIEW
"Outlook for the Electronics Industry in the World of Tariffs & Trade Tensions"

11:30 - 11:45:
Guest Speaker: WSG Senior Manager, Mr Ashley YAP
"Talent Development & Attraction"

11:45 - 12:00:
Token of Appreciation to Guest Speakers

12:00 pm - 1:00 pm

Networking Lunch (Conference Speakers & Delegates)

1:00 pm - 5:30 pm
gabriel
Session Chair
Mr. Gabriel LIM
Senior Manager, Industry Development, A*STAR Institute of Microelectronics (IME), Singapore

Chair and Speaker Introductions

1:00 pm - 1:30 pm
reiha
Keynote Speaker
Dr. Michael REIHA
General Manager, Soitec Microelectronics Singapore Pte Ltd, Singapore

FD-SOI: The 5th Gear in Next-Generation Radio

1:30 pm - 2:00 pm
walter
Mr. Walter CHAO
VP, Strategic Planning, R&D, Amkor Technology Singapore Holding Pte Ltd, Singapore

Advanced Packaging Solutions for Emerging HPC & 5G Applications

2:00 pm - 2:30 pm
CLARK TSENG
Mr. Clark TSENG
Director, Industry Research & Statistics, SEMI, Taiwan

SEMI Market Outlook – Fab Investment, 300mm, Equipment/Materials Markets and New Asia Supply Chain

2:30 pm - 3:00 pm
DR MASAY
Dr. Masaya KAWANO
Senior Scientist, Institute of Microelectronics (IME), A*STAR, Singapore

Bonding Technology for 3D Memory

3:00 pm - 3:05 pm

Speaker's Plaque Presentation by Session Chair

3:00 pm - 3:30 pm

Networking Coffee/Tea at Exhibits Area

3:30 pm - 4:00 pm
yk
Dr. LIM Yeow-Kheng
Deputy Director, STATS ChipPAC, JCET Group, Singapore

Multi-die 2.5D uFOS and eWLB FOWLP for High Performance Applications

4:00 pm - 4:30 pm
lee chee ping
Mr. LEE Chee Ping
Senior Technologist & Technical Marketing Manager, Lam Research Corporation, Singapore

When the Package is the Star

4:30 pm - 5:00 pm
polin
Mr. Polin CHI
Packaging Account Technology Manager, Mentor Graphics (Taiwan) Ltd, Taiwan

Packaging Design and DFM in The Era of 5G and AI

5:00 pm - 5:30 pm
kwon
Mr. KWON SoonMook
Senior Field Marketing Manager, National Instruments, Korea

Overcoming Test Challenges of 5G New Radio

5:30 pm - 5:35 pm

Speaker's Plaque Presentation by Session Chair

Friday, 8 Nov 2019 - Day 2

9:00 am - 9:30 am

Registration with Welcome Coffee/Tea

9:30 am - 5:30 pm
lin
Session Chair
Dr. LIN Kuang Kuo
Programme Director, A*STAR Institute of Microelectronics (IME), Singapore

Chair and Speaker Introductions

9:30 am - 10:10 am
HEM
Keynote Speaker
Mr. Hem TAKIAR
Corporate Vice President, Package Development & Engineering, Micron Technology, Inc., USA

The Needs on Advanced Package Structure for Next Generation for Emerging Applications

10:10 am - 10:40 am
faviar
Mr. Favier SHOO
Technology and Market Analyst, Semiconductor & Software Devision, Yole Développement, Singapore

The Evolution of Packaging and its Inspection Challenges

10:40 am - 11:10 am
rahman
Mr. Yuwono RAHMAN
Senior Staff – Product & Test Engineer, Silicon Laboratories, Inc., Singapore

Optimizing Module Test on Wireless IoT Products

11:10 am - 11:30 am

Networking Coffee/Tea at Exhibits Area

11:30 am - 12:00 pm
CHAN CHEE KIN
Mr. CHAN Chee Kin
System Application Consultant, Advantest (Singapore) Pte Ltd, Singapore

5G Testing Solutions and Challenges

12:00 pm - 12:30 pm
eugene
Prof. Eugene A. FITZGERALD
CEO & Director, Singapore-MIT Alliance for Research and Technology, Singapore

Future of Chip Technology: When Moore’s Law Ends

12:30 pm - 12:35 pm

Speaker's Plaque Presentation by Session Chair

12:35 pm - 1:30 pm

Networking Lunch (Conference Speakers & Delegates)

1:30 pm - 2:00 pm
FARHANG
Mr. Farhang YAZDANI
President & CEO, BroadPak, Corporation, USA

Advanced Interconnects for AI/HPC and 5G Packaging

2:00 pm - 2:30 pm
ERIC
Mr. Eric NG
Business Development, ASM Pacific Technology (Hong Kong)

Advanced Interconnect for Heterogeneous Integration for future 5G/AI era

2:30 pm - 3:00 pm
albert
Mr. Albert LAN
Senior Global Packaging Technical Director, Applied Materials Taiwan Ltd, Taiwan

3D-SiP Heterogeneous Integration Packaging Technology Challenges and Solutions for 5G and AI Applications

3:05 pm - 3:30 pm

Coffee/Tea at Exhibits Area

3:30 pm - 4:00 pm
PASCAL
Mr. Pascal PIERRA
Snr. VP/GM SLT-I Business Unit, AEM Holdings Pte Ltd, Singapore

Backend Test Paradigm Shift with System-Level-Test

4:00 pm - 4:30 pm
SHI XIAO KE
Mr. SHI Xiao Ke
Optics Manager, Component Technology Pte Ltd, Singapore

The Evolution of Packaging and its Inspection Challenges

4:30 pm - 5:00 pm
CHONG
Mr. CHONG Chan Pin
Senior VP, EA/APMR & Wedge Bonders Business Units, Kulicke & Soffa Pte Ltd, Singapore

Advanced Packaging Technology for Memory

5:00 pm - 5:30 pm
DR DARIO
Dr. Dario ALLIATA
Director of Business Unit, Unity Semiconductor Pte Ltd, Singapore

Process Control Solutions for Advanced Packaging

5:30 pm - 5:35 pm

Speaker's Plaque Presentation by Session Chair

Delegate Pricing

PRICE LIST

*Includes 2 networking breaks & 1 lunch per day
*Delegate pass allows entry to both ASTC and FLEX SEA 2019
*All prices in SGD & exclude 7% GST

Register now to enjoy the early-bird rate!

Malaysia Companies HRDF Claimable
Download HRDF Endorsement letter below
(Subject to T&C and please contact HRDF for more information)

PRICE LIST

VENUE INFORMATION

MBS

Marina Bay Sands is a premier entertainment destination with its vibrant diversity of attractions and facilities. The vision was to build an integrated development that is timeless, a landmark that possesses a distinct identity which distinguishes Singapore from other cities.

Located along the Marina Bay waterfront, Marina Bay Sands features three cascading hotel towers topped by an extraordinary sky park, 'floating' crystal pavilions, a lotus-inspired Museum, retail stores featuring cutting-edge labels and international luxury brands, trendy Celebrity Chef restaurants, endless entertainment at the theatres, the hottest night clubs and a Las Vegas-style casino. Business visitors will also enjoy the extensive Meetings, Incentives, Conventions and Exhibitions (MICE) facilities featuring state-of-the-art technology, highly flexible exhibition halls, and a convention centre that can host over 45,000 delegates.

Marina Bay Sands seamlessly combines business and leisure into a singular destination unlike any other.

Car & Taxi

Marina Bay Sands is situated at 10 Bayfront Avenue, and is also accessible by vehicle via Sheares Avenue. From Changi Airport, you can reach us in a 20-minute direct drive along the East Coast Parkway (ECP) expressway, which leads directly into Sheares Avenue across the Benjamin Sheares Bridge.

There are four pick-up/drop-off points for cars and taxis:
1) on Sheares Link outside Hotel Lobby Tower 1
2) along Bayfront Avenue outside Hotel Lobby Tower 3
3) outside Sands Expo & Convention Centre
4) outside The Shoppes.

MRT Train Services

Marina Bay Sands is linked directly to CE1/DT16 Bayfront Station on the Circle Line and Downtown Line of Singapore's Mass Rapid Transit (MRT) train system. MRT services to/from Bayfront Station operate daily from (approximately) 6:00am to 12:00am midnight.

Exits at Bayfront Station:

Exits C & D: Connect to The Shoppes at Marina Bay Sands (1 minute walk), Sands Expo & Convention Centre (3 minute walk), the Hotel (5 minute walk), Sands SkyPark (10 minute walk), ArtScience Museum (10 minute walk), and Sands Theatre (10 minute walk). Signs direct the way to each location and other attractions at Marina Bay Sands.
Exit E: Connects to Sands Expo & Convention Centre.

There are three car park entry points at Marina Bay Sands:

  • South Entrance on Bayfront Link
  • North Entrance on Bayfront Avenue
  • Entrance at Hotel Tower 3

Complimentary Parking is offered when you are member of Sands Rewards LifeStyle (free to join), or with a minimum spend at The Shoppes, any Celebrity Chef restaurant, ArtScience Museum, or Sands Theatre.

Valet parking is offered at the pick-up/drop-off points outside Hotel Lobby Tower 1 and outside The Shoppes.

MBS

Sponsors

A Big Thank You To Our ASTC 2019 Sponsors

AEM
Applied Materials
ASMPT
GlobalFoundries
KLA
K&S
Lam Research
Unity Semiconductor
UTAC

Table-Top Exhibiting Companies

AEM
Singapore Institute of Manufacturing Technology (SIMTech)
Central Midori
ITE
Kaha
Lam Research
M-Edge
TRUMPF
Unity
WSG