February 10, 2017
Location
United States
Agenda Annual Tokyo SOI WorkshopPresentations
During the one and a half day workshop, leading companies working in the domain of SOI based technologies were meeting together in Tokyo to discuss about SOI Ecosystem and “Convergence of IoT, Automotive through Connectivity”.
May 31st, 2017: FDSOI Ecosystem @ Yokohama Landmark Tower
TCAD, EDA and IP to Support FDSOI -David Dutton, CEO Silvaco (presentation not public) FDX™ Goes Mainstream - Gregg Bartlett, SVP GlobalFoundries INVECAS IP Portfolio in 22FDX - Bhaskar Kolla, Sr.Director Business Development and Customer Engineering, Invecas FDSOI : A Low Power, High Performance Technology Scalable Down to 10nm - Laurent Grenouillet, Expert, CMOS & Memory Integration, CEA-Leti I-Fuse(tm): The Best OTP of Choice for FD-SOI and Sub-14nm Nodes - Shine Chung, Chairman, Attopsemi Technology Product Design Methodology - Christophe Tretz, SOI Consortium
June 1st, 2017 , “Convergence of IoT, Automotive through Connectivity” @ Takeda Hall, Tokyo University, Tokyo
Ultra Low Power ApplicationsSony Semiconductor Solutions , Low Power IoT Solution -Kenichi Nakano, General Manager, Sony IoT (presentation not public) Technologies for Automotive LIDARs and Sensor Fusion ECUs Advancing ADAS Architectures towards Automated Driving - Akhilesh Kona, Senior Analyst, IHS Markit MIPS Leading Heterogeneous Compute in Automotive & IoT - Steven Yeung, Design Manager, MIPS, Imagination Technologies Future of Automotive Industry - Road is Paved with SOI - Vincent Roger, Corporate Business Developer, CEA-Leti IoT – Connectivity - Infrastructure Enabling An Interconnected Digital World - Jonathan Smith, Director, Cadence Nokia Future X Network for 5G and IoT -Brian Cho, Head of Technology for APAC & Japan, Nokia on infrastructure for 4G/5G Delivering on the Promises of 5G: Semiconductor Solutions for the Next Wave of Data - Peter Rabbeni, Senior Director, GlobalFoundries Sensor-to-Cloud Connectivity Solution for IoT - Hiroshi Noguchi, Director of AMG Product Marketing, STMicroelectronics Supply Chain Enabling SOI and IoT: An Equipment and Materials Engineering Perspective - Sesh Ramaswami, Managing Director, Applied Materials (presentation not public) SCREEN Equipment Manufacturer: Full participation within the SOI Consortium - Hirofumi Uchida, Senior VP, Screen Role of Substrate in Accelerating Mass Adoption of SOI Technologies -Thomas Piliszczuk, EVP, Soitec (presentation not public)