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Session 9

Big Data, Automation and Analytics 1

Session Chairs: Stefan Radloff, Thomas Beeg, Fred Bouchard

The availability of vast amounts of data is now being met with increasing compute capabilities and algorithmic approaches to predict properties of final products, equipment health and metrology results, and influence WIP flow decisions.

Wednesday, May 3, 2023

12:30 PM ET 
9.1 Automotive Process Reliability Prediction for 5,7nm using ML 

Srividya Jayaram, Andres Torres, Ivan Kissiov, Melody Tao, Nathan Greeneltch, Siemens EDA; SP Hong, Sanghyun Choi, Hyung Joo Lee, Rio Kwak, Siemens EDA Korea; Dongin Kim, Seungwon Paek, Minho Kwon, Ho Lee, Yeongdo Kim, Hyobe Jung, Samsung Electronics

12:55 
9.2 Semantic Modeling for Smart Manufacturing: Towards a Data Alignment Through Knowledge Formalization for Semiconductor Wafer Fabrication 

Giulia Maslov, Philippe Vialletelle, STMicroelectronics; Claude Yugma, Mines Saint-Etienne 

1:20 
9.3 PAML for Virtual Metrology 

Thomas J Ashby, Wilfried Verachtert, Roel Wuyts, IMEC; Anastasiia Doinychko, Andres Torres, Mentor A Siemens Business; Daniele Pagano, STMicroelectronics

1:45 
9.4 Smarter Etch Inline Defect Monitoring by Risk-Based Sampling 

James Akey, Sam Marble, Fei Yu, Brian Ford, Neils Rackwitz, Joerg Lohse, Fab 8 GlobalFoundries 

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