Defect Inspection
Session Chairs: George Kong, Alexa Greer, Shravan Matham
In-line inspection is critical for modern semiconductor processing. The session talks about defect inspection/review for a wide range of use cases from front to backend of line. This discussion includes application of machine learning to optimize use of inspection tools for defect learnings.
Wednesday, May 3, 2023
12:30 PM ET
8.1 Utilization of ExtractAI Inspection and Review Methodology to Accelerate Process Development in Advanced Technology Nodes
Teresa A Esposito, Nathaniel Mowell, Felix Levitov, Applied Materials; Shravan Matham, Monirul Islam, Susan Emans, Rebekah Sheraw, IBM Research
12:55
8.2 A Decade of Chasing the Origin of Nano-Whisker/Dendrite Defects from Reliability Qualification into Customer Returns
Lieyi Sheng, Wei Pan, onsemi
1:20
8.3 Combining Full Wafer Inspection with Deep Learning to Recognize Wafers with Critical Defects
Sabrina Anger, Anil Bora Yayak, Georg Roeder, Martin Schellenberger, Fraunhofer Institute for Integrated Systems and Device Technology IISB; Thomas Alcaire, Delphine Le Cunff, STMicroelectronics; Máté Nagy, Semilab
1:45
8.4 Maximizing Efficiency of Inspection tools using SONR
Rehab Kotb Ali, Nacer Zine El Abidine, Le Hong, Siemens EDA Egypt; Sylvain Olivier Moulis, STMicroelectronics