Advanced Metrology 2
Session Chairs: Franz Heider, Felix Levitov
Innovative metrology techniques like infrared ellipsometry, XPS, XRD, Auger, TEM and thermomechanical measurements make important contributions to process development and characterization.
Wednesday, May 3, 2023
9:10 AM ET
7.1 3D NAND SiO2/SiN Tier Stack Thickness Measurement with IR Metrology
Youcheng Wang, Zhuo Chen, Cong Wang, Nick Keller, Andrew G Antonelli, Zhuan Liu, Troy Ribaudo, Rostislav Grynko, Onto Innovation
9:35
7.2 Establishing a Link Between Carbon Concentration and Contact Angle on HMDS Surfaces
Roland Barbosa, Phat Tan Nguyen, Randel Gene Thompson, Samsung Austin Semiconductor; Seunghoon Lee, Kangwon Kim, Sangjae Park, Samsung Electronics
10:00
7.3 Curvature Measurements to Improve Polymer Integration in Microelectronic Devices
Benjamin Vavrille, Laurent-Luc Chapelon, STMicroelectronics; Rafael Estevez, Lionel Vignoud, Univ. Grenoble Alpes
10:25
7.4 M-FOUP SYSTEM performance in a semiconductor process control
Yevgeny Lifshitz, David Novack, Jack Downey, Fahad Alhasawi, Globalfoundries; John Byrnes, Alfred Hajtman, Peter Basa, Anna Bolcskei-Molnar, Csaba Nándor Bitvai, Istvan Nemeth, Krisztina Kover, SEMILAB
10:50
7.5 Improved Throughput and Cost of Ownership for Monitoring of FBEOL Etch Profile
Carrie Yurkon, Padraig Timoney, Jusang Lee, Mark Altwerger, GlobalFoundries