Equipment Optimization
Session Chairs: Fred Bouchard, Misty Thompson, Viji Seshachalam
Advanced manufacturing requires timely information, robust parts and a solid understanding of the interplay between components and process. This session will focus on new ways to calibrate epi chambers, coatings to protect chamber components and prevent flaking, impact of plating nozzles on copper voiding, and modeling of elastomer aging in sealing applications.
Wednesday, May 3, 2023
9:10 AM ET
6.1 Plasma Corrosion Resistant ALD Coatings for Semiconductor Manufacturing Process Equipment
Lassi Leppilahti, Beneq
9:35
6.2 Qualification and Optimization of New Post-WCMP Cleaning Chemical for ReRAM Process
Samrat Paul, Hong Jin Kim, Kevin Hanley, GlobalFoundries
10:00
6.3 Predicting Aging Effects and Permanent Set of Vacuum Sealing Systems in Semiconductor Manufacturing Processes
Alan Astbury, Christoph Wehmann, Ambarish Kulkarni, Feyzan Durn, Murat Gulcur, Trelleborg Sealing Solutions
10:25
6.4 A comprehensive Study on Spin-On-Dielectric (SOD) Voids: Root Cause Analysis, Impact, and Amelioration
Ketaki Sarkar, Johnny Nieves, Laud Abantei, Arika Fritz, Aayush Mittal, Michael Hurt, Micron Technology
10:50
6.5 Chemical Uniformity Impacts on Electrodeposition
Joel Christian Warner, Adam Anthony Chalupa, Jarett Clay Martin, Marcus Minchew, Samsung Austin Semiconductor