Poster Session
Session Chairs: Ankit Jain, Bradley Wood, Deepak Patel, Fred Bouchard, Igor Turovets, Leonard Rubin, Oliver Patterson, Ralf Buengener, Reshmi Mitra, Samira Bagheri , Saurabh Dutta Chowdhury, Shekhar Bakshi, Shiladitya Chakravorty, Shubhodeep Goswami, Siddarth Sampath, Thanas Budri, Viji Seshachalam
Tuesday, May 2, 2023
| Reduction of Defects with Single Piece Upper Electrode (SPUE) in Oxide Etch Applications | Chai Fook Yen, Tan Pui Hoon, Chang Hsiao Liang, Pang Kong Yeow, Ben Tay, GlobalFoundries |
| Reducing CFx rResidue from Etching Process by Optimizing Post Plamsa Treatment | Ki Dong Yang, Youngeun Kim, Nuri Lim, Heeseong Yang, Taehee Han, Jungyup Lim, Eunyoung Han, Young Jeong Kim, Joong Jung Kim, Samsung Electronics |
| Flux Real-Time Imaging System: High-Speed, High-Throughput Automated Visual Inspection and Defect Detection for Monitoring Flux Dispense | Chris Edwards, Robin Wilcox, Darren Vance, Meghana Swamy, Nancy Xu, Intel |
| Pre-Litho Backside Etch for Improved Flatness and Yield | Reshmi Mitra, Alper Konuk, Samsung Austin Semiconductor |
| Investigation of Factors Causing Watermark Defect on Hydrophobic Silicon Surface | Dineshan Adukkadukkam, Alan Goh, Kiat Sean Tan, Yiwen Zhang, Shau Chiet Ooi, GlobalFoundries |
| CIS FBM Classification Using Machine Learning Algorithm and Specific Defect Prediction Analysis | Jihye Lim, Jinseok Kim, Seungjun Son, Seokjun Won, Saerom Lee, Samsung Electronics |
| Method to Reduce Block Defect caused by Cu precipitation using Ar/N2 plasma | Rajkumar Thiruchelvam, Joshua Edwin Suryana, Ramadas Nambatyathu, GlobalFoundries |
| Dynamic SIMS analytical methods for optimized detection limits of atmospheric species | SeoYoun Choi, Kilian Soulard, Laura Creon, Paula Peres, Shiro Miwa, Jinlei Ren, CAMECA |
| Eliminating Polymer Flaking on a Passivation Etch Chamber using Carbon Polymer Coating Method | Noel Portes Igana, Kim Shiang Loh, Rendy Wiyogo Gozali, Haiqing Zhang, GlobalFoundries |
| Quadrant Yield Loss Due to Resist Chemistry And Device Layout Interaction | Jane Chow, Dineshan Adukkadukkam, Alan Goh, GlobalFoundries Singapore |
| Edge Zonal Low Yield in FinFET Manufacturing | Yong Guo, Juheon Kim, Nathan McEwen, Chris Penley, Sergei Drizlikh, Samsung Austin Semiconductor |
| Product Yield Enhancement by Control Gate to Active Area Distance within Wafer Uniformity Improvement | Darren Young, Suraj Kaul, Jacob Tiernan, Ganquan Song, Andres Prado Espinoza, Bhaskar Pant, Sarvesha Kumar Kombaiah Seetha, Micron Technology |
| Study on Ashing-less Dry Etching Process to Eliminate Q-time Defect Formation | Jinbum Myeong, Joon Young Kang, Hyun Sook Kim, Jinwoong Kim, Yeji Kim, Kang Uk Kim, Seokyong Sohn, Ohduk Choi, Bokoo Kang, Min Heo, Jongsoo Yim, Samsung Electronics |
| Automation in R&D: complying with contradictory constraints of seemingly incompatible world | Vincent Fischer, Olivier Landré, Matthieu Duranton, CEA-Leti |
| Simulated Annealing Based Artificial Neural Network For Real Time Dispatching | Shiladitya Chakravorty, GlobalFoundries; Nagendra N Nagarur, Binghamton University |
| Improved Cycle Time of CDSEM Measurements Through Novel Alignment Methodologies & Data Storage Optimization | Robert S. Brown, Carmen Power, Ellen Pike, Michael Lenahan, GlobalFoundries |
| Introducing Lens Stress Methodology to High Volume Manufacturing | Samantha Langlitz, John Tristan, Joerg Paufler, Nathan Neal, GlobalFoundries |
| Designing Robust Topological Features for Wafer Map Pattern Classification | Xu Han, Xiaodong Jia, Dai-Yan Ji, Jay Lee, University of Cincinnati |
| Mitigation of Copper Galvanic Corrosion by Dry Etch and Wet Clean Optimization | Allen Osaheni, Daniel Jaeger, Steven Soss, Owen Hu, Peter Konrad, PiJeng Khor, GlobalFoundries |
| 10nm Particle Deposition Capability for Qualification of Next-Generation Defect Inspection Tools | William D Dick, Lindsay A Hegner, Lin Li, MSP, A Division of TSI |
| Removal of Macro Aluminum Defects on Wafer Backside | Akshit Patel, Kun Yu, Trevor Junquera, Sridhar Kuchibhatla, Nirmal Sundaramoorthy, Harith Sethupathi, Samuel Marble, Casey Biederman, Brett Yatzor, Brian O'Hara, Justin Clements, Chris Torecedo, Marc Berardi, Elizabeth Sunkel, Daniel Costello, Tyler Reynolds, Michael Hatzistergos, Vincent Sih, Bradley Morgenfield, Olugbenga Famodu, GlobalFoundries |
| Enhanced Cu CMP Process Control by Machine Learning Enabled Measurement on E-Test Macro | Padraig Timoney, Joseph Luke, Mark Rovereto, Jordan Wyble, Roger Lien, GlobalFoundries |
| Complex Challenges in Meriting the BEOL IMD Reliability | Lieyi Sheng, Ihsiu Ho, Alex Vayshenker, onsemi |
| Application of CNN to TSOM Images for Successful Classification of 6 nm Node Patterned Defects | Ravikiran Attota, TSOMTech; Armando Anaya, Northrop Grumman |
| Characterization of TSV capacitor by silicon substrate | Jusang Lee, Mark Altwerger, Seung-Yeop Kook, Asmaa Elkadi, Jung-Suk Goo, James Kim, GlobalFoundries |
| Microcircuit Defect and Counterfeit Detection via Silicon Geometry | Carlos Moreno, Palitronica; Philippe Vibien, Srijan Pabbi, Lukas Schmidt, Goksen Guler, Sebastian Fischmeister, University of Waterloo |
| In-situ measurement of depletion zones in power devices | Gregory Johnson, Andreas Rummel, Chengliang Huang, Zeiss; Heiko Stegmann, Kleindiek Nanotechnik |
| Optimizing Fab Operations Using Simulation and Artificial Intelligence-Based Dispatching Algorithms | Benjamin Kovács, University of Klagenfurt |