Advanced Metrology 1
Session Chairs: Delphine LeCunff, Alok Vaid
This session contains presentations from a variety of techniques, applied in novel ways to provide important information for process and quality improvements. These techniques include overlay measurements, CD-SEM and scatterometry. Artificial intelligence, machine learning and deep learning are employed to improve the quality of measurements.
Tuesday, May 2, 2023
9:55 AM ET
2.1 AI-Based Image Processing for Phtoresist Latent Image Enhancement
Benyamin Davaji, Jiaxian Chen, Peter C Doerschuk, Amit Lal, Cornell University; Cliff McCold, Ajit Paranjpe, Veeco
10:20
2.2 Machine Learning for Deep Trench Bottom Width Measurements using Scatterometry
Sasmita Srichandan, Franz Heider, Yulia Polak, Georg Ehrentraut, Laszlo Juhasz, Infineon Technologies Austria AG; Martin Haberjahn, Infineon Technologies Dresden; Egidijus Sakaluskas, Ronny Haupt, Nova Measuring Instruments
10:45
2.3 OPO Reduction by Imaging Signal Optimization in an Advanced Memory Device Process
Nahee Park, Yuqian Zhang, Mark Stakely, Greg Gray, Yonglei Li, Peter Kimani, Shlomit Katz, Yoav Grauer, Neeraj Khanna, KLA; Nikhil Aditya Kumar Roy, Suresh Ramakrishnan, Steve McCandless, Jason Reece, Nathan Gillespie, Nils Monserud, Micron Technology
11:10
2.4 Manufacturing Cost Saving Through Reduced Metrology Utilizing Time Series Analysis
Richard P. Good, Ashok Sedhain, Jessica Kim, Erik Milosevic, Alok Vaid, Globalfoundries
11:35
2.5 Double U-Net based Virtual Metrology on Plasma-Etch SEM Images
Benyamin Davaji, Shuhan Ding, Yiling Peng, Peter C. Doerschuk, Amit Lal, Jeremy Clark, Garry Bordonaro, Vincent Genova, Christopher K. Ober, Cornell University; Steve Ayres, Marco Heuser, Hitachi High-Tech America