Contamination Free Manufacturing
Session Chairs: Jennifer Braggin, Chris Ebert, Chris Long, Siddarth Sampath
Contamination in the form of particulates, surface impurities and volatile organic compounds can have a significant impact on semiconductor wafer fab yield and reliability. This session will feature papers focused on process improvements to reduce overall on-wafer contamination in order to eliminate killer defects, drive yield improvement and minimize yield.
Thursday, May 4, 2023
9:30 AM ET
14.1 Solving Intermittent Metallic Furnace Contamination
David Tucker, Jeff Hebert, Thanas Budri, Texas Instruments
9:55
14.2 A Role of N2 and O2 Gasses in Post Etch Treatment (Pet) For Removing Fluorocarbon-based By-product Outgassing in Dram Memory
Jeff J Ye, Micron Technology; Wan-Ping Lien, San Chen, Micron Memory Taiwan
10:20
14.3 WET Organic Impurities induced Carbon Contamination on Surface/Sub-surface of Silicon
Tatt Wai Wan, Infineon Technologies