Advanced Equipment Processes and Materials 2
Session Chairs: Chris Long, Thirumalesh Bannuru
This session explores novel reactive ion etch and dry clean process improvements with focus on improving process stability and yield through process optimization or chamber conditioning.
Thursday, May 4, 2023
8:00 AM ET
13.1 A Novel Continuous Plasma Etch with Optimized Algorithms for Yield Improvement and High Production Throughput in NOR Memory
Jeff J Ye, Fei Lu, Haifeng Sheng, Param Singh, Micron Technology
8:25
13.2 Common Source Line-to-Word Line Short Improvement by Eliminating SLT Sidewall Notch in 3D NAND Deep Trench Patterning
Yao-An Chung, Yuan-Chieh Chiu, Chih-Chin Chang, Hong-Ji Lee, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu, Macronix International
8:50
13.3 Elimination of Trapped Charges in Photonic Devices to Reduce Propagation Loss
Moe Hein Phyu, Daiyu Huang, Moh Moh, Purnendu Bikash Sahoo, GlobalFoundries