Advanced Equipment Processes and Materials 1
Session Chairs: Jean Wynne, Cody Murray
This session explores novel chemical mechanical polish and deposition process improvements with focus on improving film characteristics, process efficiency, and surface characteristics.
Wednesday, May 3, 2023
2:35 PM ET
10.1 Innovative Approaches for RG 3D NAND CMP Buff Steps Elimination with Fab Cost and Carbon Footprint Reduction
Xinqiao Dong, Russell McCabe, Subhadeep Mukherjee, Yi Yang, Micron Technology; Yaolun Yong, Hsuehchuang Wong, Micron Semiconductor Asia
3:00
10.2 Impact of Warmup Wafer Surface Quality on Product Wafer Defectivity in CMP Process
Nakul Pitre, Christopher Reepmeyer, Keith Moore, Sally Zhen, Micron Technology
3:25
10.3 Reduction of Streak Signature of SiGe Epitaxial Unwanted Growth by Pre-cleaning Process Recipe Optimization
Kun Yu, Sneha Gaddam, GlobalFoundries
3:55
10.4 Novel Wafer-Scale Adhesive Bonding with Improved Alignment Accuracy and Bond Uniformity
Salim abdi, Marc Speigelberg, Yuqing Jiao, Kevin Williams, Eindhoven University of Technology; Tjibbe de Vries, Nanolab@tu/e