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Session 1

Yield Enhancement / Yield Methodologies 1

Session Chairs: Ishtiaq Ahsan, David Tucker, Viji Seshachalam, Shravan Matham

Yield improvement is one of the primary goals in any manufacturing. This requires not only eliminating defects, but also resolving parametric detractors, addressing design marginality and systematic problems. In this session we will have presentations which addresses various yield issues and their resolutions. Authors will be discussing impact on queue time on cobalt resistivity and defectivity, defects and mitigation actions in a 3D NAND process, methods using DSIM to detect defects in interconnects, 3D modeling of a plasma etch process and mitigation of galvanic corrosion in Cu interconnects in a Finfet technology.

Tuesday, May 2, 2023

9:55 AM ET
1.1 Manufacturing Yield Improvement for Advanced Cmos Technology Middle-Of-Line Interconnect with Cobalt Metallization 
Su Chen Fan, Paul Jamison, Shanti Pancharatnam, Muthumanickam Sankarapandian, Ruilong Xie, Chris Waskiewicz, Jay Strane, Joe Lee, Hosadurga Shobha, James Demarest, Cornelius Brown Peethala, Hemanth Jagannathan, Jean Wynne, IBM Research 

10:20
1.2 Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio Etching Process
Chih-Chin Chang, Ching-Hung Hsiao, Yi-Che Chen, Ching-Hung Wang, Yao-An Chung, Li-Wei Wang, Hong-Ji Lee, Nan-Tzu Lian, Shih-Chin Lee, Tzung-Ting Han, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu, Macronix International 

10:45
1.3 Semiconductor Film Stack Interface Investigation via DSIMS&TOFSIMS Depth Profiling and XPS Nondestructive Techniques
Thanas Budri, Jeffrey Klatt, Jyahoon Chung, Aaron Clubb, Texas Instruments; Kateryna Artyushkova, Jennifer Mann, Physical Electronics 

11:10
1.4 BinDeviation: a Metric of Geometric Accuracy for Plasma-etch 3D Modeling Using Computer Vision
Benyamin Davaji, Yutong Xie, Cornell University; Peter C. Doerschuk, Amit Lal, Ivan Chakarov, Sandy Wen, Michael Hargrove, David Fried, Lam Research 

11:35
1.5 Elimination of Cu Precipitation in Al-Cu films due to the Effect of Thermal Cycles
Sajidul Haque Siraji, Rajkumar Thiruchelvam, Lim Koon, GlobalFoundries

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