Advanced Metrology 1 - Novel Metrology Techniques
Chairs: Jay Mody, Delphine LeCunff
This session contains presentations from a variety of techniques, applied in novel ways to provide important information for process and quality improvements. These techniques include x-ray tomography, Ramanspectroscopy, thermal characterization and AFM.
Wednesday, May 4, 2022
12:10 PM ET
9.1 In-line Raman Spectroscopy: High-Throughput Strain Metrology for 3D Devices.
Amir Nourbakhsh, Lan Yu, Tyler Sherwood, Xing Chen, Siddarth Krishnan, Applied Materials; Pui Hung, SUNY Polytechnic Institute; Aron Cepler, Marjorie Cheng, Nova, Inc
12:35
9.2 Non-Contact, In-line Thermal Characterization Capability with Time Domain Thermoreflectance.
Robin Mair, Andy Antonelli, Manjusha Mehendale, Priya Mukundhan, Onto Innovation; Beth May, Nathaniel Brandt, Karen Terry, Seagate Technology LLC
1:00
9.3 Conductive AFM in SEM for 7 nm.
Greg Johnson, Thomas Rogers, Heiko Stegmann, Frederick Pearsall, Zeiss Microscopy; Frank Hitzel, DoubleFox, GmbH
1:25
9.4 An Advanced Bragg Diffraction Imaging Technique to Characterize Defects in SiC and GaN.
Thu Nhi Tran Thi, Jose Baruchel, European Synchrotron Radiation Facility