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Session 6

Advanced Semiconductor Developments 1

Chairs: Jeanne Bickford, Shubhodeep Goswami, Marc Bergendahl, Robert Pearson

Papers in this session address advances and concerns across the semiconductor industry, encompassing novel device manufacturing, innovative silicon, non-silicon, and non-CMOS devices.

Tuesday, May 3, 2022

3:30
6.1 Enabling Glass Wafers in a Si Fab.

Jay Zhang, Corning Incorporated; Chee-Hau Ng, United Microelectronics; Sebastien Kouassi, pSemi

3:55
6.2 Novel Micro-Textured Film Offers Promise in Universal Handling of 3D Devices.

Raj Varma, Jennifer Nunes, Delphon

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