Advanced Equipment Processes and Materials
Chairs: Fred Bouchard, Katie Lutker-Lee, Thirumalesh Bannuru
This session focuses on tool matching using temperature comparisons, 3D NAND deep trench etching and waferless clean optimization in etch tools.
Thursday, May 5, 2022
10:00 AM ET
16.1 Continuous Plasma Etch Process With Waferless Chamber Clean Optimization for Defect Reduction by Eliminating Center Injector Shading.
Jeff Ye, John Lee, Michael Davis, Micron Technology
10:25
16.2 Photo Track Equipment 400 Degree Wireless TC Wafer Utilization Analysis.
Seunguk Cha, Bonwang Koo, SK Hynix; Kwanghyun Jin, KLA
10:50
16.3 Study of Twisting Bottom Line Edge Roughness (LER) of 3D NAND Deep Trench Etching.
Yao-an Chung, Yuan-Chieh Chiu, Yu-Fan Chang, Hong-Ji Lee, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu, Macronix International Co., Ltd