downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
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Session 15

Advanced Semiconductor Developments 2

Chairs: Jeanne Bickford, Robert Pearson, Marc Bergendahl, Thirumalesh Bannuru

Papers in this session address advances and concerns across the semiconductor industry, encompassing novel device manufacturing, innovative silicon, non-silicon, and non-CMOS devices.

Thursday, May 5, 2022

8:00 AM ET
15.1 High Temperature Resilience of Deposited Films in Harsh Environment Semiconductor Devices.

Cheng-Po Chen, Shubhodeep Goswami, Robert Gossman, GE Research

8:25
15.2 Fabrication of SeFe2O4-based Schottky diode using Cantilever-based Ag-contact Printing Technology.

Joshua Palathinkal, Thomas Daniel, Roy Palathinkal, K-fab Tech Private Limited; Sumit Majumder, ETH Zurich; Vimal Yadav, Birla Institute of Technology Mesra


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