Yield Enhancement / Yield Methodologies 2
Chairs: Larry Pulvirent, Jeff Ye, Victor Chan
Yield can be viewed as being closely tied to equipment performance (process capability), operator capability, and technological design and process complexity. Yield is the single most important factor in overall wafer processing costs, as incremental increases in yield significantly reduce manufacturing costs. In this session, we will cover issues like Laser anneal vs surrounding environment and its impact to device/yield performance, and optimization of Poly and STI CMP to reduce defectivity and improve inline Cpk.
Thursday, May 5, 2022
8:00 AM ET
14.1 Observation of Pattern Sensitivity In Laser Anneal.
Raymond van Roijen, Mark Hurley, Pial Mirdha, Jeffrey Brown, Globalfoundries
8:25
14.2 Root Cause Identification and Mitigation of Polysilicon CMP Underpolish Increase in DRAM Manufacturing.
Ritesh Ray Chaudhuri, Russell McCabe, Samantha Spangler, Ahmed Tahraoui, Emmett Synder, William Simpson, Michael Frachel, Glen Martin, Micron Technology
8:55
14.3 NOR Yield Enhancement and Downstream Process Variation Reduction by STI CMP Optimization.
Russell McCabe, Suraj Kaul, Ronilo Acosta, Kevin Ward, Bhaskar Pant, Micron Technology Inc