Advanced Metrology 2 - Patterning Methodology
Chairs: Ronny Haupt, Alok Vaid
This session is focused on patterning metrology and topics related to dimensional measurements with different approaches.
Wednesday, May 4, 2022
2:10 PM ET
11.1 Electrically Testable Product Macro Multi-via Measurement for Within Die CD Variation.
Carol Boye, Steven McDermott, Samuel Choi, Norbert Arnold, Nicole Saulnier, Alex Varghese, Injo Ok, Iqbal Saraf, IBM; DukKyun Moon, Felix Levitov, Uri Smolyan, Alex Goldenshtein, Noam Amit, Applied Materials
2:35
11.2 On an Application of Denoising to the Uncertainty Quantification of Line Edge Roughness Estimation.
Inimfon Akpabio, Serap Savari, Texas A&M
3:00
11.3 Combination of Mass Metrology with Scatterometry to Obtain Bottom Width of Deep Trenches.
Martin Haberjahn, Sasmita Srichandan, Yulia Polak, Georg Ehrentraut, Franz Heider, Infineon Technologies
3:25
11.4 Wafer Geometry Technique for Blank 300mm Silicon Wafers.
Álvaro Pérez-García, Juan M. Trujillo-Sevilla, Jose Manuel Ramos-Rodríguez, Jan Gaudestad, Wooptix