Reliability Physics and Acceleration Factors for FHE Circuits under Sustained Temperature and Stresses of Daily Motion
Abstract
Reliability assurance requires a fundamental understanding of failure physics and acceleration factors for the dominant failure mechanisms. No standards exist to assure the reliability of FHE. Reliability physics of failure mechanisms are needed for foundational data-based standards to mitigate the risk with the adoption of additively manufactured electronics, assess the effect of design changes on realized performance, shorten the development time for new FHE products, and achieve repeatable, consistent performance from generation to generation. Deliverables from the proposed program will include reliability data, physics of failure of the dominant failure mechanisms, and acceleration factors for additively manufactured IoT sensors and wearable devices. Specifically, failure mechanisms will be studied under exposure to sustained ambient temperatures, power dissipation, human-body temperatures, and stresses of daily motion, including flex-to-install and dynamic flexing found in both IoT sensors and wearable electronics. A tiered test-vehicle approach to the electronics architecture stack is proposed to develop reliability requirements and determine the relationships between accelerated test conditions and the operating environment. The three categories of test vehicles addressed in this project include (1) conductive traces, (2) assembled components, and (3) functional circuits. The reliability distributions, failure modes, and mechanisms under a variety of temperature and deformation magnitudes will be used to formulate models for acceleration factors of FHE.
Biography
Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of Auburn University’s Electronics Packaging Research Institute. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering and the Department of Finance. He is a member of the technical council and academic co-lead of automotive and asset monitoring TWGs of NextFlex Manufacturing Institute. He is the author and co-author of 2-books, 15 book chapters, and over 1000 journal and conference papers in the field of electronics. Dr. Lall is a fellow of the ASME, fellow of the IEEE, a Fellow of NextFlex Manufacturing Institute, and a Fellow of the Alabama Academy of Science. He is recipient of SEMI’s FLEXI R&D Achievements Award for landmark contributions to Additive Printed Electronics, ASME Avram Bar-Cohen Memorial Medal, IEEE Biedenbach Outstanding Engineering Educator Award, IEEE Sustained Outstanding Technical Contributions Award, NSF Alex Schwarzkopf Award, Alabama Academy of Science Wright A, Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Fifty Best-Paper Awards.