17 March 2015: Shanghai Workshop MEMS & More than Moore

PresentationsMore than Moore market and technology trends

, Thibault Buisson, Yole Developpement Wafer-Level Heterogeneous Integration Technology and Its Application, Prof. Shuji Tanaka, Tohoku University, Sendai, Japan Prominent Materials of HIST to enable the IoT, Prof. G.P. Li, Calit2, University of California-Irvine, USA Biosensors and Healthcare, Dr. Qinghuang Lin, IBM T.J. Watson Research Center, USA Vitual Fabrication for advanced Semiconductor technology, David M. Fried, Coventor Overview of Power SOI Application, Dr. Bernard Aspar, Soitec Power SOI Application, Dr. James Young, Skyworks RF SOI: A Deeper Insight for a Faster Time-to-Market, Dr. Mostafa Emam, Incize Photonics, RF- & FD-SOI for IoT Applications, Kirk Ouellette, STMicroelectronics SOI for RF Applications and Beyond, Alfred Zhu,, Sitri