The unique role of SOI: How GF’s FD-SOI and RFSOI solutions make the case for a multi-technology future

With RFSOI in 80% of premium smartphones and FDX™ FD-SOI enabling edge AI, Silicon-on-Insulator (SOI) technology fills a unique role in the semiconductor landscape. The SOI Industry Consortium conducted an interview with Jamie Schaeffer, VP of Ultra-low Power CMOS Product Line at GlobalFoundries (GF), to discuss and highlight GF’s differentiated solutions for power-sensitive, high-frequency, and harsh-environment applications.

While foundational technologies like bulk CMOS and FinFETs have driven significant advancements, no single semiconductor technology optimally addresses all the diverse requirements of modern applications. This necessitates a strategic shift towards a varied technological toolkit. Silicon-on-Insulator (SOI) technologies, particularly GlobalFoundries’ RFSOI and FDX™ FD-SOI platforms, offer highly differentiated solutions that precisely address existing gaps – especially for applications that are acutely power-sensitive, operate at demanding high frequencies, or endure harsh environmental conditions – for which SOI technologies are uniquely suited.

Where Each Technology Platform Shines: GF’s SOI Portfolio at-a-glance

GlobalFoundries’ portfolio exemplifies a clear commitment to a multi-technology future, where each platform is meticulously optimized to deliver solutions for a variety of performance metrics and application requirements. This strategic diversification ensures that designers are equipped with the precise tools necessary for maximizing efficiency and performance across a broad spectrum of uses.

Within their broad technology portfolio, GF offers key SOI technologies. This includes RFSOI solutions, which are engineered for high-performance 5G radio frequency applications – including uses in premium smartphones. In addition, their FDX™ FD-SOI platform uses unique back biasing for dynamic power savings, making it ideal for edge AI applications, IoT, and wearables. The following table provides a concise overview of GF’s key SOI technologies, illustrating their unique advantages and primary applications. To learn more about GF’s SOI technologies, as well as additional technology platforms and applications, visit GF.com.

SOI’s Secret Sauce: The Performance-Power-Cost Triad

The fundamental advantages of SOI technology can be distilled into a powerful triad: superior performance, exceptional power efficiency, and compelling cost-effectiveness for specific applications. This holistic value proposition makes SOI a strategic choice for many of today's most demanding electronic systems.

FDX FD-SOI's unique back biasing capability allows for dynamic adjustment of the transistor's threshold voltage, significantly reducing leakage current. This is critical for always-on IoT devices and other power-sensitive applications, translating directly into extended battery life and reduced energy consumption. As Jamie Schaeffer, VP of Ultra-low Power CMOS Product Line at GF notes, "AI at the edge demands doing more with less power. GF’s SOI technology delivers that and more".

GF’s FDX™ technology platform offers FinFET-class digital performance within a simpler, more cost-effective planar process. This cost-effectiveness is paired with best-in-class RF capabilities, making it an ideal integrated solution for mixed-signal designs. 

Furthermore, RFSOI technology inherently possesses superior radiation hardness due to its insulating buried oxide layer, making it exceptionally resilient to ionizing radiation. This is optimal for demanding space applications, including supporting satellites and spacecrafts, and is critical for automotive electronics. RFSOI also offers excellent noise resilience, which is vital for maintaining the quality and integrity of high-frequency signals, particularly important for robust 5G communication.

The SOIIC Ecosystem: Collaboration as a Force Multiplier

The widespread adoption of Silicon-on-Insulator (SOI) technology is driven by a robust, collaborative ecosystem fostered by the SOI Industry Consortium (SOIIC). The SOIIC promotes a collaborative development model by working with IP and Electronic Design Automation (EDA) providers like Synopsys, IP and custom silicon design service providers like VeriSilicon, as well as research organizations like CEA Leti. This collaboration ensures designers have access to the necessary EDA tools and intellectual property (IP) as well as helps to align technology roadmaps across the ecosystem.

As a crucial member of the consortium, GlobalFoundries boasts a geographically diversified manufacturing footprint, with state-of-the-art fabs spanning the U.S., Europe, and Asia, enhancing supply chain resilience and global cooperation. This is further strengthened by a strategic partnership with SOITEC, a leading supplier of SOI wafers, ensuring a stable and secure foundation for SOI production. 

The SOIIC is actively tackling the specialized knowledge gap in the workforce by investing in comprehensive training. This gap exists because SOI technology requires a unique understanding that differs from traditional silicon. Expertise is needed in areas like unique device physics, manufacturing processes for thin silicon films, and design optimization techniques for specific applications. These initiatives are designed to equip engineers and technicians with the expertise to effectively design, manufacture, and utilize SOI-based solutions.

The Future: SOI’s Role in AI, Chiplets, and Beyond

SOI technology is not merely a solution for current challenges; it is a critical, foundational enabler for the most significant trends shaping the future of computing. Its inherent advantages position it at the forefront of innovation in areas such as chiplets, leading-edge artificial intelligence, and advanced communication systems.

FDX FD-SOI’s inherent ultra-low power characteristics make it uniquely suited for the burgeoning field of AI at the Edge, enabling complex on-device inference without relying on constant cloud connectivity or excessive power consumption. RFSOI’s exceptional high-frequency capabilities position it as a key enabler for future communication systems operating in the Terahertz (THz) band, promising ultra-high bandwidth. Furthermore, RFSOI’s proven radiation hardness and reliability also make it an ideal choice for demanding space applications, where components must withstand extreme conditions.

Furthermore, GlobalFoundries is at the forefront of advanced packaging innovation through its dedicated Advanced Packaging and Photonics Center in New York. This facility features new production capabilities for advanced packaging, wafer-to-wafer bonding, assembly, and testing of 3D and Heterogeneous Integration (HI) chips. These capabilities integrate seamlessly with GF’s leading-edge platforms, including 12LP+, 22FDX®, and various RF platforms, demonstrating SOI’s foundational role in future chip architectures that demand modularity and high-density integration. 

GlobalFoundries and the SOIIC are actively elevating the differentiated benefits of SOI technology, showcasing its unique value proposition across a spectrum of demanding applications.  Click here for Jamie’s thoughts on how GF’s RFSOI and FD-SOI solutions are game-changing for critical industries