In this session, GDSI provided an introduction to the Stealth dicing process, highlighting the applications it is most well suited to, and shared design rules and process window specifications.
The Stealth laser dicing process is a water-free, particle-free wafer singulation method. It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.
Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology.
Speaker: Rich Boardman, Senior Sales Engineer at GDSI, San Jose, California. (PDF)
Video
Watch the video as Richard Boardman talks about the Stealth Dicing Process.