FLEX Taiwan 2021 Call for Abstracts

In recent years, flexible hybrid electronics (FHE) has been widely introduced into terminal applications such as displays, automotive, smart medical care, wearable applications and the IoT since it featured with light weight, curved, and variable in form factor. Taiwan has industry advantages in flexible materials, semiconductors, electronic components, production equipment, and manufacturing processes, which makes Taiwan enable to develop the FHE market and create innovated application of electronic products related to automotive, smart health care, smart textile, wearable device and more.

Starting from 2018, SEMI Taiwan held FLEX Taiwan for the fourth year, by holding this event we are not only bring in the advanced breakthrough into Taiwan, but also stringing up a complete ecosystem in Taiwan which made Taiwan government realized the development of Flexible Hybrid Electronics is promising and established a 4-year plan on it.

By co-locating with world’s 2^nd largest semiconductor exhibition SEMICON Taiwan, FLEX Taiwan focuses on the integration of a whole new class of FHE enabled by integration of conventional semiconductor devices with thin and flexible form factor with flexible electronic substrates, materials and processing techniques.

This year, FLEX Taiwan 2021 forum divides into three sessions: Advance Technology, Market Trend & Application and Innovation Energy to have a technical and informative sharing of the latest FHE trend and application.

SEMI FlexTech Taiwan Steering Committee encourage industry professionals from across the electronics supply chain to submit an abstract to present on FHE innovation and the impact it has on the future of electronic products.

• Important Dates
  1. 2021/10/01 Deadline of Abstract Submission 
  2. 2021/10/22 Notification of Acceptance
  3. 2021/11/26 Deadline of Final Presentation Material Submission
  4. 2021/12  FLEX Taiwan 2021  (Exact date will be confirmed soon)
• Topics of Interests for FLEX Taiwan 2021 include, but are not limited to:

1.      A. Flexible Hybrid Electronics (FHE) System

• Antenna with high frequency, e.g., mm-wave applications
• Flexible sensors integration, e.g., temperature sensors, gas sensors
• Technology that enables FHE

                B. Materials Processing

• Next-generation, high stability printed conductors, semiconductors & dielectric materials
• High-performance dielectric materials with enhanced electrical & mechanical properties required to meet the demands of next-generation FHE device applications
• Novel display materials & processing for next-generation flexible display devices
• Advanced patterning technologies for FHE
• Materials reliability testing for FHE

•     C. Sensors

• Flexible Sensors
• Environmental sensing for extreme environments
• Human biochemistry sensing
• Sensing in unique wearable form factors
• Printed Sensors for Automotive

• Submission

There are three stages for the paper submission: Abstract Submission, Review and Presentation Submission. Abstract submission is intended to collect ideas from academics and practitioners who are willing to participate and share their opinions or technologies application of the FHE practice at forum. Once the abstract be reviewed by Committee Chair and Vice Chair, applicants will receive the notification letter of acceptance and will need to submit the final presentation file before the deadline. Abstract should be submitted to the submission website, other requirements and submission process please refer below:  

1. 1. Stage One: Abstract Submission

• Personal information should be filled in at the submission website as well
• Abstract Words Limits: no more than 300 words

                 B. Stage Two: Review

All submitted paper will be reviewed by FlexTech Taiwan Steering Committee Chair, Vice Chair and SEMI Representative.

• Chair: YE Yeh, Vice President, ASE
• Vice Chair: CC Tasi, Scientific Advisor, E Ink Holdings / CC Lee, Deputy General Director, ITRI
• SEMI Representative: Jo-ann Su, Sr. Director, SEMI

       C. Stage Three: Presentation Submission (Submit the file to Ms. Yang: [email protected] directly)

• Format: PPT
• Presentation Time Limits: 20 mins
• All final presentations will be made available to conference attendees and SEMI FlexTech members. (If the final presentation material includes any confidential information, speaker can provide the releasable presentation materials after the event.)

Please Note:

Since the COVID-19 epidemic worldwide situation is still intense, the restriction of oversea traveling in Taiwan hasn’t open yet. If you are a foreign applicant and could not present in Taiwan in person due to the Taiwan entry restrictions, you are welcoming to join the forum by pre-recording and can interact with on-site audiences during the online QA time by dial in.

 

• Ms. Madeline Yang ([email protected] / +886-3-560-1777 #512)
• Ms. Jamie Lee ([email protected] / +886-3-560-1777 #310)