Paul Hoffman started his career at IBM working on flip chip and other packages. His decades of direct experience includes most types of packages such as wirebond, flip chip, ceramic, laminate, TAB, CSP, MCM, memory cards and others. While at Amkor as the head of Advanced Package Development he had the opportunity to understand the needs of customers worldwide across all applications and to direct the development of packages to meet those needs. One of those developments was very high production volume packages combining chips and SMT passives – and to describe those packages he coined the term “System in Package” or SiP in wide use today to extend the scope of packaging and contribute to the “More than Moore” era of electronics. He also spends time working with clients to understand patent and IP issues related to packaging and semiconductor processing. Paul has published many papers related to IC packaging and has over 40 issued patents, mostly in IC packaging.
MS Engineering Management/ Stanford Univ
BS Mechanical Eng/ Stanford Univ