Dr. Spangler is the President of Aspen Microsystems, LLC, a semiconductor product design and development company that provides consulting and engineering services for advanced MEMS and microelectronic devices, with specialties in semiconductor packaging and assembly technologies. Aspen Microsystems also provides technical assistance with intellectual property matters, reliability and failure analysis, manufacturing and quality operating systems.
Previously Chip was the President of Aspen Technologies, a microelectronic package and assembly service supplier. He was responsible for manufacturing and package development of hundreds of different MEMS and IC products including extremely high-pixel count displays, DNA analysis products, MEMS telecom switch arrays, microfluidic devices, biomedical and implantable devices, optical and RF MEMS, pressure and inertial sensors as well as integrated circuit devices including 2.5D and 3D packages. Prior to Aspen Technologies, Chip worked at Intel and Ford Microelectronics where his responsibilities ranged from pressure sensors, and airbag and chassis accelerometers to custom analog and mixed-signal ASICs. His work lead directly to the production of the world’s first wafer-level packaged surface-mount airbag accelerometer.
Dr. Spangler received his Ph.D. in electrical engineering from The University of Michigan in 1988. He is the author of over 35 technical publications and has 15 patents. He is currently a member of the SMTA and was an editor for IEEE JMEMS for 12 years. He has helped organize the Hilton Head and Transducers Conference Conferences as well as SPIE meetings and the IEEE MEMS Conference. He regularly teaches classes on a variety of MEMS, packaging and semiconductor topics.