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Topic Titled “Lessons Learnt in Past I4.0 Push and Opportunities in the Next 3-5 Years” 

Get perspectives on learnings from major semi players’ own I4.0 transformation initiatives and how I4.0 priorities could shift with the evolving pandemic and its impact on industry growth, customers and suppliers in the next couple of years.

Mr. Bo HUANG, Associate Partner, Mckinsey and Company

 

Moderator:
Mr. Bo HUANG, Associate Partner, McKinsey & Company, Singapore

Bo Huang is an associate partner in Singapore office. He leads McKinsey’s Semiconductor and Electronics Industry Practice in Southeast Asia.

Bo has served multiple semiconductor and advanced industry clients on 5 main topics: (1) integration operation synergy due diligence, (2) manufacturing cost optimization (labor productivity, shop floor automation, material consumption and procurement, subcontractor strategy, maintenance and spare parts, yield, supply chain, line efficiency), (3) organization efficiency and footprint remapping (4) quality management system, and (5) I4.0 transformation.

His clients span geographies including Thailand, Malaysia, Singapore, Philippines, Taiwan, China, Japan, Austria, USA. More recently Bo has developed McKinsey’s latest thinking on US-China trade tension and implication to technology sectors including AI, 5G, semiconductor. Bo has developed scenarios and strategic implications in terms of supply chain, technology roadmap, customer engagement model, and technology partnership model. In addition to semiconductor and electronics industry, Bo has also served clients from multiple sectors, including energy, medical devices, and industrial equipment.

Before joining McKinsey, Bo spent four years as a postdoctoral at Johns Hopkins Medical Institutions, Baltimore, USA. Bo obtained his PhD at the Institute of Molecular and Cell Biology, A-STAR, Singapore. He earned his bachelor’s degree (First Class Honors) in Science at the National University of Singapore.  He is native in Mandarin Chinese and fluent in English.

Ms. Adeline TAY, Senior Director, Smart Manufacturing and AI Micron Semiconductor Asia Operations, Singapore

Panelist:
Ms. Adeline TAY, Senior Director, Smart Manufacturing and AI, Micron Semiconductor Asia Operations, Singapore

Adeline Tay leads the smart manufacturing and artificial intelligence data science team that provides strategic direction to global manufacturing sites to improve operations capability and provides guidance on best known methods to achieve best-in-class manufacturing results

Dr. Andreas HAUSER, Managing Director, Digital Service, TÜV SÜD Asia Pacific

Panelist:
Dr. Andreas HAUSER, Managing Director, Digital Service, TÜV SÜD Asia Pacific, Singapore

Dr Andreas Hauser holds Degrees in Shipbuilding and Computer Engineering, and a PhD in Applied Mathematics. He started his career at Corporate Research of Siemens before joining the global safety, quality and sustainability service provider TÜV SÜD in Singapore with the mission to build up new business.

He is now leading the Centre of Excellence of Digital Service in Singapore, a key unit in TÜV SÜD´s digital transformation strategy responsible for the development of new solutions and business models around safety, cyber security and reliability of smart systems.

Dr Hauser was involved in the development and internationalisation of the Smart Industry Readiness Index from the very beginning and established a global Industry 4.0 hub in Singapore helping manufacturers worldwide realise their I4.0 transformation

Mr. Seng Meng ENG, Senior Vice President, Global Head of Industrial Engineering and I4.0 for Backend Operation, Infineon Technologies Asia Pacific, Singapore

Panelist:
Mr. Seng Meng ENG, Senior Vice President, Global Head of Industrial Engineering and I4.0 for Backend Operation, Infineon Technologies Asia Pacific, Singapore


Eng Seng Meng is the head of Industrial Engineering and I4.0 for Backend Operation at Infineon Technologies. He is responsible for driving the manufacturing standard, productivity strategies, I4.0 roadmap formulation and implementation for all Infineon Backend factories globally. Since 2016, he leads the team to spearhead the backend-wide I4.0 and Automation program.

Seng Meng started his career as a process engineer in Infineon Singapore in the early 90’s. He has since held various key leadership roles in Engineering management, Operation planning, Site management and Global function at Infineon Backend spanning across Singapore, Malaysia and China. Before the current position, he was the head of Wuxi (China) backend site and the global head of Discrete Segment, Infineon Backend.

Seng Meng holds a degree in Physics and a master’s degree in Management of Technology from the National University of Singapore.

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