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Session 8Defect Inspection II

Chairs: Shravan Matham, IBM Research; Oliver Patterson, Hermes Micro-Vision; Qintao Zhang, Applied Materials
Inline defect inspection is critical for modern semiconductor processing. The four papers this session address various topics in this area.


8.1 Automated Wafer Defect Classification Using a Convolutional Neural Network Augmented with Distributed Computing

Hairong Lei, Cho Teh, Hetong Li, Po-Hsuan Lee, Wei Fang, Hermes Microvision (An ASML company)


8.2 Advanced Inspection Methodology for the Maximum Extension of Nitride Test Wafer Recycling

Yu-Yuan Ke, Kuang-Hsiu Chen, Shin-Ru Chen, Guan-Wei Huang, Wesley Yu, Po-Jen Chuang, Chun-Li Lin, Chih-Wei Huang, Jun-Ming Chen, United Microelectronics Corporation; Nachiketa Janardan, Tung-Ying Lee, Ethan Chen, Chao-Yu Cheng, KLA


8.3  Laser-based Hair Crack Detection on Wafers

Alexander Fuchs, Franz Pernkopf, Graz University of Technology; Robin Priewald, Bright Red Systems (STUDENT)


8.4 Real-Time Tool Health Monitoring and Defect Inspection During Epoxy Dispense Process

Chris Edwards, Meghana Narayana Swamy, Ravi Garg, Tim Karaniuk, Cody L. Morgan, Debashis Panda, Intel Corporation


Networking Break

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