Session 8—Defect Inspection II
Chairs: Shravan Matham, IBM Research; Oliver Patterson, Hermes Micro-Vision; Qintao Zhang, Applied Materials
Inline defect inspection is critical for modern semiconductor processing. The four papers this session address various topics in this area.
12:25pm
8.1 Automated Wafer Defect Classification Using a Convolutional Neural Network Augmented with Distributed Computing
Hairong Lei, Cho Teh, Hetong Li, Po-Hsuan Lee, Wei Fang, Hermes Microvision (An ASML company)
12:50
8.2 Advanced Inspection Methodology for the Maximum Extension of Nitride Test Wafer Recycling
Yu-Yuan Ke, Kuang-Hsiu Chen, Shin-Ru Chen, Guan-Wei Huang, Wesley Yu, Po-Jen Chuang, Chun-Li Lin, Chih-Wei Huang, Jun-Ming Chen, United Microelectronics Corporation; Nachiketa Janardan, Tung-Ying Lee, Ethan Chen, Chao-Yu Cheng, KLA
1:15
8.3 Laser-based Hair Crack Detection on Wafers
Alexander Fuchs, Franz Pernkopf, Graz University of Technology; Robin Priewald, Bright Red Systems (STUDENT)
1:40
8.4 Real-Time Tool Health Monitoring and Defect Inspection During Epoxy Dispense Process
Chris Edwards, Meghana Narayana Swamy, Ravi Garg, Tim Karaniuk, Cody L. Morgan, Debashis Panda, Intel Corporation
2:05
Networking Break