Session 7—Factory Optimization
Chairs: Thomas Beeg, Wolfspeed; Jagdish Prasad, Silfex (Lam Research); Stefan Radloff, Intel Corporation
The challenges of current and future semiconductor process technologies require an increased application of modeling, simulation and optimization technologies. Utilization of cross-industry best practices and automated decision-making and execution will enable improved factory efficiency. Presentations in this session will discuss solutions to improve factory automation strategies and packaging.
9:20am
7.1 AMHS Capability Assessment Based on Planned Product Mixes
Robert Schmaler, Christian Hammel, FabFlow GmbH; Christian Schubert, Infineon Technologies Dresden
9:45
7.2 An Artificial Neural Network Based Algorithm for Real Time Dispatching Decisions
Shiladitya Chakravorty, GLOBALFOUNDRIES; Nagendra N. Nagarur, Binghamton University
10:10
7.3 Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry (STUDENT)
Jacob Lohmer, Christian Flechsig, Rainer Lasch, Technische Universität Dresden; Konstantin Schmidt, Jorg Dinter, Germar Schneider, Infineon Technologies Dresden
10:35
7.4 Output Improvement in High Volume Fabs by Reducing Recipe Qualifications
Ace Chen, Chris Keith, Haim Albalak, Applied Materials
11:00
7.5 Dynamic Dispatching for FOUP Cleaning
Karthik Iyer, John Barker, Shiladitya Chakravorty, Binay Dash, GLOBALFOUNDRIES
11:30
Boxed Lunch