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Session 7Factory Optimization

Chairs: Thomas Beeg, Wolfspeed; Jagdish Prasad, Silfex (Lam Research); Stefan Radloff, Intel Corporation

The challenges of current and future semiconductor process technologies require an increased application of modeling, simulation and optimization technologies. Utilization of cross-industry best practices and automated decision-making and execution will enable improved factory efficiency. Presentations in this session will discuss solutions to improve factory automation strategies and packaging.  
 

9:20am  

7.1   AMHS Capability Assessment Based on Planned Product Mixes

Robert Schmaler, Christian Hammel, FabFlow GmbH; Christian Schubert, Infineon Technologies Dresden
 

9:45

7.2 An Artificial Neural Network Based Algorithm for Real Time Dispatching Decisions

Shiladitya Chakravorty, GLOBALFOUNDRIES; Nagendra N. Nagarur, Binghamton University
 

10:10

7.3 Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry (STUDENT)

Jacob Lohmer, Christian Flechsig, Rainer Lasch, Technische Universität Dresden; Konstantin Schmidt, Jorg Dinter, Germar Schneider, Infineon Technologies Dresden
 

10:35

7.4 Output Improvement in High Volume Fabs by Reducing Recipe Qualifications

Ace Chen, Chris Keith, Haim Albalak, Applied Materials
 

11:00

7.5 Dynamic Dispatching for FOUP Cleaning  

Karthik Iyer, John Barker, Shiladitya Chakravorty, Binay Dash, GLOBALFOUNDRIES
 

11:30

Boxed Lunch
 

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