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Session 7Factory Optimization

Chairs: Thomas Beeg, Wolfspeed; Jagdish Prasad, Silfex (Lam Research); Stefan Radloff, Intel Corporation

The challenges of current and future semiconductor process technologies require an increased application of modeling, simulation and optimization technologies. Utilization of cross-industry best practices and automated decision-making and execution will enable improved factory efficiency. Presentations in this session will discuss solutions to improve factory automation strategies and packaging.  


7.1   AMHS Capability Assessment Based on Planned Product Mixes

Robert Schmaler, Christian Hammel, FabFlow GmbH; Christian Schubert, Infineon Technologies Dresden


7.2 An Artificial Neural Network Based Algorithm for Real Time Dispatching Decisions

Shiladitya Chakravorty, GLOBALFOUNDRIES; Nagendra N. Nagarur, Binghamton University


7.3 Order Release Methods in Semiconductor Manufacturing: State-of-the-Art in Science and Lessons from Industry (STUDENT)

Jacob Lohmer, Christian Flechsig, Rainer Lasch, Technische Universität Dresden; Konstantin Schmidt, Jorg Dinter, Germar Schneider, Infineon Technologies Dresden


7.4 Output Improvement in High Volume Fabs by Reducing Recipe Qualifications

Ace Chen, Chris Keith, Haim Albalak, Applied Materials


7.5 Dynamic Dispatching for FOUP Cleaning  

Karthik Iyer, John Barker, Shiladitya Chakravorty, Binay Dash, GLOBALFOUNDRIES


Boxed Lunch

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