Session 3—Defect Inspection I
Chairs: Alexa Greer, KLA; Israel Ne’eman, Applied Materials; Alex Varghese, IBM Research; Abhishek Vikram, Anchor Semiconductor
The session includes papers on SEM inspection and review followed by two applications of deep learning for defect generation and classification.
1:30pm
3.1 Creative Use of Vector Scan for Efficient SRAM Inspection
Oliver D. Patterson, Hsiao-Chi Peng, Haokun Hu, Hermes Microvision (An ASML company); Chih-Chung Huang, GLOBALFOUNDRIES
1:55
3.2 Analysis of Systematic Weak Point Structures using Design Based Automatic Defect Classification and Defect Review SEM Platform
Teresa A. Esposito, Felix Levitov, Applied Materials; Shi-Hui Jen, Qian Xie, Danda Acharya, Julie Lee, GLOBALFOUNDRIES
2:20
3.3 Electron Beam Inspection: Voltage Contrast Inspection to Characterize Contact Isolation
Richard F. Hafer, Andrew Stamper, GLOBALFOUNDRIES; Jerry Hsieh, Hermes Microvision Inc.
2:45
3.4 Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network
Yuan-Fu Yang, Min Sun, National Tsing Hua University (Student)
3:10
3.5 Generative Adversarial Networks for Synthetic Defect Generation in Assembly and Test Manufacturing
Rajhans Singh, Arizona State University and Intel; Ravi Garg, Nital S. Patel, Martin W. Braun, Intel Corporation
3:35
Networking Break