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Session 3Defect Inspection I 

Chairs: Alexa Greer, KLA; Israel Ne’eman, Applied Materials; Alex Varghese, IBM Research; Abhishek Vikram, Anchor Semiconductor

The session includes papers on SEM inspection and review followed by two applications of deep learning for defect generation and classification.


1:30pm

3.1   Creative Use of Vector Scan for Efficient SRAM Inspection

Oliver D. Patterson, Hsiao-Chi Peng, Haokun Hu, Hermes Microvision (An ASML company); Chih-Chung Huang, GLOBALFOUNDRIES


1:55

3.2   Analysis of Systematic Weak Point Structures using Design Based Automatic Defect Classification and Defect Review SEM Platform

Teresa A. Esposito, Felix Levitov, Applied Materials; Shi-Hui Jen, Qian Xie, Danda Acharya, Julie Lee, GLOBALFOUNDRIES


2:20

3.3   Electron Beam Inspection: Voltage Contrast Inspection to Characterize Contact Isolation

Richard F. Hafer, Andrew Stamper, GLOBALFOUNDRIES; Jerry Hsieh, Hermes Microvision Inc.
 

2:45

3.4   Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network

Yuan-Fu Yang, Min Sun, National Tsing Hua University (Student)

 
3:10

3.5   Generative Adversarial Networks for Synthetic Defect Generation in Assembly and Test Manufacturing

Rajhans Singh, Arizona State University and Intel; Ravi Garg, Nital S. Patel, Martin W. Braun, Intel Corporation
 

3:35   

Networking Break
 

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