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Session 3Defect Inspection I 

Chairs: Alexa Greer, KLA; Israel Ne’eman, Applied Materials; Alex Varghese, IBM Research; Abhishek Vikram, Anchor Semiconductor

The session includes papers on SEM inspection and review followed by two applications of deep learning for defect generation and classification.


3.1   Creative Use of Vector Scan for Efficient SRAM Inspection

Oliver D. Patterson, Hsiao-Chi Peng, Haokun Hu, Hermes Microvision (An ASML company); Chih-Chung Huang, GLOBALFOUNDRIES


3.2   Analysis of Systematic Weak Point Structures using Design Based Automatic Defect Classification and Defect Review SEM Platform

Teresa A. Esposito, Felix Levitov, Applied Materials; Shi-Hui Jen, Qian Xie, Danda Acharya, Julie Lee, GLOBALFOUNDRIES


3.3   Electron Beam Inspection: Voltage Contrast Inspection to Characterize Contact Isolation

Richard F. Hafer, Andrew Stamper, GLOBALFOUNDRIES; Jerry Hsieh, Hermes Microvision Inc.


3.4   Double Feature Extraction Method for Wafer Map Classification Based on Convolution Neural Network

Yuan-Fu Yang, Min Sun, National Tsing Hua University (Student)


3.5   Generative Adversarial Networks for Synthetic Defect Generation in Assembly and Test Manufacturing

Rajhans Singh, Arizona State University and Intel; Ravi Garg, Nital S. Patel, Martin W. Braun, Intel Corporation


Networking Break

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