Session 2—AM 1: Optical Metrology & Machine Learning
Chairs: Vivek Jain, ASML; Delphine Le Cunff, STMicroelectronics; Felix Levitov, Applied Materials; Alok Vaid, GLOBALFOUNDRIES
This session is focused on optical metrology methods and includes advancements and their utilization in novel ways. The topics relate to optical metrology techniques and machine learning.
10:05am
2.1 Development of Inner Spacer Process Control to Enable Nanosheet FET Technology
Dexin Kong, Daniel Schmidt, Mary Breton, Abraham Arceo de la pena, Julien Frougier, Lan Yu, Andrew Green, Jingyun Zhang, Liying Jiang, Veeraraghavan Basker, Nicolas Loubet, Ishtiaq Ahsan, IBM Research; Aron Cepler, Mark Klare, Marjorie Cheng, NOVA
10:30
2.2 The Adoption of Machine Learning in the Measurement of Copper Contact on the Main Chip in Advanced 3D NAND Technology Nodes
Michael Meng, Albert Li, Andrew Zhang, Leeming Tu, Haydn Zhou, Jian Mi, Yangtze Memory Technologies Co.; Xi Zou, Nanometrics
10:55
2.3 Applying Machine Learning to Reflectometry Spectra of Ultra-Thin Oxide Films in High Volume Manufacturing
Ashok Sedhain, Padraig Timoney, Philip Hatfield, Roma Luthra, Alok Vaid, GLOBALFOUNDRIES; Paul Isbester, Haibo Liu, Igor Turovets, Avi Levy, NOVA
11:20
2.4 Characterization of Sub Micron Metal Line Arrays Using Picosecond Ultrasonics
M. Mehendale, M Kotelyanskii, R. Mair, P. Mukundhan, Onto Innovation; J. Bogdanowicz, L. Teugels, A.-L. Charley, P. Kuszewski, imec
11:45
2.5 Spectroscopic Ellipsometry Imaging for Process Deviation Detection via Deep Learning Approach
T. Alcaire, D. Le Cunff, V. Gredy, STMicroelectronics, J.H. Tortai, University Grenoble Alpes
12:15pm
Networking Lunch