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Session 11AM 2: Patterning and 3D M II

Chairs: Ronny Haupt, NOVA; Sean Teehan, IBM Research; Padraig Timoney, GLOBALFOUNDRIES

This session is focused on patterning metrology, and the topics related to overlay, SEM and interferometry techniques.
 

2:30pm

11.1 Overlay Improvement for Semiconductor Manufacturing Using Moiré Effect

Yoshinori Hagio, Kentaro Kasa, Sho Kawadahara, Manabu Takakuwa, KIOXIA Corporation; Yosuke Takahata, Katsuya Kato, Akihiro Nakae, Western Digital Corporation
 

2:55

11.2 Improved Duplicate Photomask Matching using AIMS™ Metrology for 14nm and Smaller

Jean Raymond Fakhoury, Mark Lawliss, Tom Faure, Amy Zweber, Yurong Ying, Chris Magg, Bradley Morgenfeld, GLOBALFOUNDRIES
 

3:20

11.3 SEM Image Denoising and Contour Image Estimation using Deep Learning

Narendra Chaudhary, Serap A. Savariy, Texas A&M University; Varvara Brackmannz, Michael Friedrich, Fraunhofer Institute for Photonic Microsystems
 

3:45

11.4 Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy

Ravi Kiran Attota, National Institute of Standards and Technology


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