Session 11—AM 2: Patterning and 3D M II
Chairs: Ronny Haupt, NOVA; Sean Teehan, IBM Research; Padraig Timoney, GLOBALFOUNDRIES
This session is focused on patterning metrology, and the topics related to overlay, SEM and interferometry techniques.
2:30pm
11.1 Overlay Improvement for Semiconductor Manufacturing Using Moiré Effect
Yoshinori Hagio, Kentaro Kasa, Sho Kawadahara, Manabu Takakuwa, KIOXIA Corporation; Yosuke Takahata, Katsuya Kato, Akihiro Nakae, Western Digital Corporation
2:55
11.2 Improved Duplicate Photomask Matching using AIMS™ Metrology for 14nm and Smaller
Jean Raymond Fakhoury, Mark Lawliss, Tom Faure, Amy Zweber, Yurong Ying, Chris Magg, Bradley Morgenfeld, GLOBALFOUNDRIES
3:20
11.3 SEM Image Denoising and Contour Image Estimation using Deep Learning
Narendra Chaudhary, Serap A. Savariy, Texas A&M University; Varvara Brackmannz, Michael Friedrich, Fraunhofer Institute for Photonic Microsystems
3:45
11.4 Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy
Ravi Kiran Attota, National Institute of Standards and Technology
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