downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

Session 11AM 2: Patterning and 3D M II

Chairs: Ronny Haupt, NOVA; Sean Teehan, IBM Research; Padraig Timoney, GLOBALFOUNDRIES

This session is focused on patterning metrology, and the topics related to overlay, SEM and interferometry techniques.


11.1 Overlay Improvement for Semiconductor Manufacturing Using Moiré Effect

Yoshinori Hagio, Kentaro Kasa, Sho Kawadahara, Manabu Takakuwa, KIOXIA Corporation; Yosuke Takahata, Katsuya Kato, Akihiro Nakae, Western Digital Corporation


11.2 Improved Duplicate Photomask Matching using AIMS™ Metrology for 14nm and Smaller

Jean Raymond Fakhoury, Mark Lawliss, Tom Faure, Amy Zweber, Yurong Ying, Chris Magg, Bradley Morgenfeld, GLOBALFOUNDRIES


11.3 SEM Image Denoising and Contour Image Estimation using Deep Learning

Narendra Chaudhary, Serap A. Savariy, Texas A&M University; Varvara Brackmannz, Michael Friedrich, Fraunhofer Institute for Photonic Microsystems


11.4 Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy

Ravi Kiran Attota, National Institute of Standards and Technology

Go back to ASMC