MILPITAS, Calif. — March 4, 2018 — SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2019) will bring together more than 100 industry experts and highlight more than 35 technical presentations spanning all aspects of semiconductor manufacturing. May 6-9, 2019, in Saratoga Springs, New York, ASMC 2019 gathers semiconductor professionals for the latest information on practical applications of advanced manufacturing strategies and methodologies. Early-bird registration discounts are available until March 19.
ASMC 2019 features “Time to Yield vs. Time to Productivity: What Matters Most in the Age of More than Moore?,” a discussion with a diverse panel of experts from Axcelis, GLOBALFOUNDRIES, SkyWater Technology and TechSearch International. The program also includes a tutorial on contamination control by Intel Corporation.
ASMC is the premier venue for industry professionals to network, learn and share insights into the latest and best-method semiconductor manufacturing practices and concepts. The conference is co-chaired by Chris Ebert of Linde and Dr. Franz Heider of Infineon Technologies Austria.
The ASMC 2019 keynote program line-up includes:
Robert Czetina, Infineon Technologies Austria
Christine Dunbar, GLOBALFOUNDRIES
Robert Maire, Semiconductor Advisors
ASMC 2019 technical sessions include:
- Advanced Metrology
- Advanced Process Improvement
- Advanced Materials and Photonics
- Advanced Process Control
- Contamination Free Manufacturing
- Defect Inspection
- Factory Optimization
- Materials Integration and Photonics
- Yield Management
ASMC includes an interactive poster session (including student presentations) and receptions, providing an ideal opportunity for presenters and conference attendees to network.
Back by popular demand, the Women in Semiconductors program – May 6 in conjunction with ASMC 2019 – will highlight the importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Registration is complimentary for ASMC attendees.
ASMC 2019 is presented by SEMI with technical sponsors including Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Electrons Packaging Society (EPS). Corporate sponsors include Applied Seals, Edwards, GreeneTweed, Inficon, KLA and NOVA.
For conference details contact Margaret Kindling at email@example.com or by phone at 1.202.393.5552. Qualified members of the media should contact Michael Hall (SEMI Public Relations) at firstname.lastname@example.org for media registration information.
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and connect with SEMI on LinkedIn and Twitter.